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TH50VSF3680: 产品描述SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE; 文件大小555KB，共55页; 制造商Toshiba(东芝); 官网地址http://toshiba-semicon-storage.com/

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TH50VSF3680概述

SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE

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TH50VSF3680/3681AASB

TENTATIVE

TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS

SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE

DESCRIPTION

The TH50VSF3680/3681AASB is a mixed multi-chip package containing a 8,388,608-bit Full CMOS SRAM and a

67,108,864-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.

The power supply. FLASH MEMORY a Simultaneous Read/Write operation so that data can be read during a Write

or Erase operation. The TH50VSF3680/3681AASB can range from 2.7 V to 3.3 V. The TH50VSF3680/3681AASB is

available in a 69-pin BGA package, making it suitable for a variety of design applications.

FEATURES

•

Power supply voltage

CCs

2.7 V~3.3 V

CCf

2.7 V~3.3 V

Data retention supply voltage

CCs

1.5 V~3.3 V

Current consumption

Operating: 45 mA maximum (CMOS level)

Standby: 10

µA

maximum (SRAM CMOS level)

Standby: 10

µA

maximum (FLASH)

Block erase architecture for flash memory

8 Kbytes

64 Kbytes

Organization

CIOF

CIOS

Flash Memory

4,194,304 words of 16 bits

8,388,608 words of 8 bits

SRAM

524,288 words of 16 bits

1,048,576 words of 8 bits

•

Function mode control for flash memory

Compatible with JEDEC-standard commands

Flash memory functions

Simultaneous Read/Write operations

Auto-Program

Auto Chip Erase, Auto Block Erase

Auto Multiple-Block Erase

Program Suspend/Resume

Block-Erase Suspend/Resume

Data Polling/Toggle Bit function

Block Protection/Boot Block Protection

Automatic Sleep, Hidden ROM Area Supports

Common Flash Memory Interface (CFI)

Byte/Word Mode

Erase and Program cycle for flash memory

cycles (typical)

Boot block architecture for flash memory

TH50VSF3680AASB: Top boot block

TH50VSF3681AASB: Bottom boot block

Package

P-FBGA69-1209-0.80A3: 0.31 g (typ.)

PIN ASSIGNMENT

(TOP VIEW)

•

Case: CIOF

, CIOS

(×16,

×16)

PIN NAMES

A0~A22

A12S

A12F

DQ0~DQ15

CEF

A15

A21

A16

Address Inputs

A12 Input for SRAM

A12 Input for Flash Memory

A19 Input for SRAM

Data Inputs/Outputs

Chip Enable Input for Flash Memory

Output Enable Input

Write Enable Input

Data Byte Control Input

Ready/Busy Output

Hardware Reset Input

Write Protect/Program Acceleration Input

Word Enable Input for SRAM

Word Enable Input for Flash Memory

Power Supply for SRAM

Power Supply for Flash Memory

Ground

Not Connected

Don’t Use

000707EBA2

CEF

CE1S

DQ0

DQ8

CE1S , CE2S Chip Enable Inputs for SRAM

A18

A17

DQ1

DQ9

DQ10

DQ2

WP/ACC

RESET

CE2S

A20

A19

A10

DQ6

A11

A12

A13

A14

, UB

RY/BY

RESET

WP/ACC

CIOS

CIOF

CCs

CCf

RY/BY

DQ3

CCf

DQ11

DQ4

DQ13 DQ15 CIOF

DQ7

DQ14

CCs

DQ12

CIOS

DQ5

•

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general

can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,

when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid

situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to

property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most

recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide

for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..

•

The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal

equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are

neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or

failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control

instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control

instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document

shall be made at the customer’s own risk.

2001-03-06 1/55

TH50VSF3680相似产品对比

	TH50VSF3680	TH50VSF3681AASB
描述	SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE	SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE

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