IC,SERIAL EEPROM,16KX8,CMOS,LLCC,8PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | SON, SOLCC8,.11,20 |
| Reach Compliance Code | compli |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 内存密度 | 131072 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 端子数量 | 8 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | 225 |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 写保护 | HARDWARE |

| CAT24C128HU3I | CAT24C128HU3I-G | CAT24C128ZI-G | CAT24C128WI | CAT24C128WE | CAT24C128YI | CAT24C128YE | CAT24C128YE-G | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,SERIAL EEPROM,16KX8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,16KX8,CMOS,LLCC,8PIN,PLASTIC | IC IC,SERIAL EEPROM,16KX8,CMOS,TSSOP,8PIN,PLASTIC, Programmable ROM | IC,SERIAL EEPROM,16KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,16KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,16KX8,CMOS,TSSOP,8PIN,PLASTIC | IC,SERIAL EEPROM,16KX8,CMOS,TSSOP,8PIN,PLASTIC | IC,SERIAL EEPROM,16KX8,CMOS,TSSOP,8PIN,PLASTIC |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| Reach Compliance Code | compli | compliant | compliant | unknown | compli | unknow | compliant | compliant |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e4 |
| 内存密度 | 131072 bi | 131072 bit | 131072 bit | 131072 bit | 131072 bi | 131072 bi | 131072 bit | 131072 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | SON | TSSOP | SOP | SOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | SOLCC8,.11,20 | SOLCC8,.11,20 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | 225 | 225 | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | 225 |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000002 A | 0.000001 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - |
| 包装说明 | SON, SOLCC8,.11,20 | SON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | - | SOIC-8 | - | TSSOP-8 | TSSOP-8 |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | - | 1 | 1 |
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