BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
274 & 281 SERIES
Standard
P/N
274-1AB
274-1ABE-01
274-1ABE-02
274-2AB
274-2ABE-01
274-2ABE-02
274-3AB
274-3ABE-01
274-3ABE-02
281-1AB
281-2AB
Height Above
PC Board
in. (mm)
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Low-Cost, Low-Height Wavesolderable Heat Sinks
Footprint
Dimensions
in. (mm)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
274 SERIES
274-XAB-01
274-XAB-02
TO-220
Material: Aluminum,
Black Anodized
Mounting
Configuration
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vertical
Vertical
Solderable
Tab Options
No Tab
01
02
No Tab
01
02
No Tab
01
02
No Tab
No Tab
Mounting
Style
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
274 SERIES
281 SERIES
Dimensions: in. (mm)
2
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