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12103D226KAT2A

产品描述CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210
产品类别无源元件   
文件大小2MB,共28页
制造商Intersil ( Renesas )
官网地址http://www.intersil.com/cda/home/
下载文档 详细参数 选型对比 全文预览

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12103D226KAT2A概述

CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210

电容, 陶瓷, 多层, 25 V, ×5R, 22 uF, 表面贴装, 1210

12103D226KAT2A规格参数

参数名称属性值
最大工作温度85 Cel
最小工作温度-55 Cel
负偏差10 %
正偏差10 %
额定直流电压urdc25 V
加工封装描述芯片
无铅Yes
欧盟RoHS规范Yes
中国RoHS规范Yes
状态ACTIVE
端子涂层MATTE 锡 OVER 镍
安装特点表面贴装
制造商系列×5R
尺寸编码1210
电容22 uF
包装形状矩形的 PACKAGE
电容类型陶瓷
端子形状WRAPAROUND
温度系数15%
温度特性代码×5R
多层Yes

文档预览

下载PDF文档
Dual 15A/Single 30A Step-Down Power Module
ISL8225M
The ISL8225M is a fully-encapsulated step-down switching
power supply that can deliver up to 100W output power from a
small 17mm square PCB footprint. The two 15A outputs may
be used independently or combined to deliver a single 30A
output. Designing a high-performance board-mounted power
supply has never been simpler -- only a few external
components are needed to create a very dense and reliable
power solution.
Automatic current sharing and phase interleaving allow up to
six modules to be paralleled for 180A output capability. 1.5%
output voltage accuracy, differential remote voltage sensing
and fast transient response create a very high-performance
power system. Built-in output over-voltage, over-current and
over-temperature protection enhance system reliability.
The ISL8225M is available in a thermally-enhanced QFN
package. Excellent efficiency and low thermal resistance
permit full power operation without heat sinks or fans. In
addition, the QFN package with external leads permits easy
probing and visual solder inspection.
Features
• Fully-encapsulated dual step-down switching power supply
• Up to 100W output from a 17mm square PCB footprint
• Dual 15A or single 30A output
• Up to 95% conversion efficiency
• 4.5V to 20V input voltage range
• 0.6V to 6V output voltage range
• 1.5% output voltage accuracy with differential remote
sensing
• Up to six modules may be paralleled to support 180A output
current
• Output over-voltage, over-current and over-temperature
protection
• Full power operation without heat sinks or fans
• QFN package with exposed leads permits easy probing and
visual solder inspection
Related Resources
• See
AN1789
“ISL8225MEVAL2Z 6-Phase, 90A Evaluation
Board Setup Procedure”
• See
AN1790
“ISL8225MEVAL3Z 30A, Single Output
Evaluation Board Setup Procedure”
• See
AN1793,
“ISL8225MEVAL4Z Dual 15A/Optional 30A
Cascadable Evaluation Board”
• See
ISL8225M 110A Thermal Performance Video
Applications
• Computing, networking and telecom infrastructure
equipment
• Industrial and medical equipment
• General purpose point-of-load (POL) power
V
IN
4.5V TO 20V
4x22µF
VIN1
VIN2
EN/FF1
EN/FF2
VSEN2-
VCC
MODE
SGND
PGND
4.7µF
ISL8225M
VOUT1
VOUT2
VSEN1+
VSEN1-
VMON1
VMON2
COMP1
COMP2
R
SET
1kΩ
1.2V@30A
V
OUT
1kΩ
5x100µF
17m
m
17
mm
OFF ON
7.5mm
470pF
NOTE: ALL PINS NOT SHOWN ARE FLOATING.
FIGURE 1. COMPLETE 30A STEP-DOWN POWER SUPPLY
FIGURE 2. SMALL FOOTPRINT WITH HIGH POWER DENSITY
December 3, 2012
FN7822.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Copyright Intersil Americas Inc. 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.

12103D226KAT2A相似产品对比

12103D226KAT2A ISL8225M TMK325BJ226MM-T 12106D107MAT2A EEVHA1E331UP GRM32ER60J107M GRM32ER61E226KE15L
描述 CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210 CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210 CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210 CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 100 uF, SURFACE MOUNT, 1210 CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210 CAPACITOR, CERAMIC, MULTILAYER, 25 V, X5R, 22 uF, SURFACE MOUNT, 1210 CAP CER 22UF 25V 10% X5R 1210
最大工作温度 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel -
最小工作温度 -55 Cel -55 Cel -55 Cel -55 Cel -55 Cel -55 Cel -
负偏差 10 % 10 % 10 % 20 % 10 % 10 % -
正偏差 10 % 10 % 10 % 20 % 10 % 10 % -
额定直流电压urdc 25 V 25 V 25 V 6.3 V 25 V 25 V -
加工封装描述 芯片 芯片 芯片 芯片 芯片 芯片 -
无铅 Yes Yes Yes Yes Yes Yes -
欧盟RoHS规范 Yes Yes Yes Yes Yes Yes -
中国RoHS规范 Yes Yes Yes Yes Yes Yes -
状态 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE -
端子涂层 MATTE 锡 OVER 镍 MATTE 锡 OVER 镍 MATTE 锡 OVER 镍 MATTE 锡 OVER 镍 MATTE 锡 OVER 镍 MATTE 锡 OVER 镍 -
安装特点 表面贴装 表面贴装 表面贴装 表面贴装 表面贴装 表面贴装 -
制造商系列 ×5R ×5R ×5R ×5R ×5R ×5R -
尺寸编码 1210 1210 1210 1210 1210 1210 -
电容 22 uF 22 uF 22 uF 100 uF 22 uF 22 uF -
包装形状 矩形的 PACKAGE 矩形的 PACKAGE 矩形的 PACKAGE 矩形的 PACKAGE 矩形的 PACKAGE 矩形的 PACKAGE -
电容类型 陶瓷 陶瓷 陶瓷 陶瓷 陶瓷 陶瓷 -
端子形状 WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND -
温度系数 15% 15% 15% 15% 15% 15% -
温度特性代码 ×5R ×5R ×5R ×5R ×5R ×5R -
多层 Yes Yes Yes Yes Yes Yes -

 
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