SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QFN |
包装说明 | QCCJ, LDCC28,.5SQ |
针数 | 28 |
Reach Compliance Code | _compli |
架构 | PAL-TYPE |
最大时钟频率 | 25 MHz |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e3 |
长度 | 11.5062 mm |
湿度敏感等级 | 1 |
专用输入次数 | 14 |
I/O 线路数量 | 6 |
输入次数 | 20 |
输出次数 | 8 |
产品条款数 | 64 |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 14 DEDICATED INPUTS, 6 I/O |
输出函数 | COMBINATORIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 220 |
电源 | 5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 25 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Matte Tin (Sn) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 11.5062 mm |
TIBPAL20L8-25CFN | TIBPAL20R8-25CNT | TIBPAL20R8-25CFN | TIBPAL20R6-25CNT | TIBPAL20R6-25CFN | TIBPAL20R4-25CNT | TIBPAL20R4-25CFN | TIBPAL20L8-25CNT | |
---|---|---|---|---|---|---|---|---|
描述 | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits | SPLD - Simple Programmable Logic Devices Low-Power High-Perf Impact PAL Circuits |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 |
零件包装代码 | QFN | DIP | QFN | DIP | QFN | DIP | QFN | DIP |
包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 |
针数 | 28 | 24 | 28 | 24 | 28 | 24 | 28 | 24 |
Reach Compliance Code | _compli | compli | _compli | compli | _compli | compli | _compli | compli |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
最大时钟频率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 |
长度 | 11.5062 mm | 31.64 mm | 11.5062 mm | 31.64 mm | 11.5062 mm | 31.64 mm | 11.5062 mm | 31.64 mm |
专用输入次数 | 14 | 12 | 12 | 12 | 12 | 12 | 12 | 14 |
I/O 线路数量 | 6 | - | - | 2 | 2 | 4 | 4 | 6 |
输入次数 | 20 | 12 | 12 | 14 | 14 | 16 | 16 | 20 |
输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
端子数量 | 28 | 24 | 28 | 24 | 28 | 24 | 28 | 24 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
组织 | 14 DEDICATED INPUTS, 6 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 4 I/O | 12 DEDICATED INPUTS, 4 I/O | 14 DEDICATED INPUTS, 6 I/O |
输出函数 | COMBINATORIAL | REGISTERED | REGISTERED | MIXED | MIXED | MIXED | MIXED | COMBINATORIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | QCCJ | DIP | QCCJ | DIP | QCCJ | DIP |
封装等效代码 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
峰值回流温度(摄氏度) | 220 | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
传播延迟 | 25 ns | 15 ns | 15 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | YES | NO | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 11.5062 mm | 7.62 mm | 11.5062 mm | 7.62 mm | 11.5062 mm | 7.62 mm | 11.5062 mm | 7.62 mm |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | - | 不含铅 | 含铅 | 不含铅 |
厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
JESD-609代码 | e3 | e4 | e3 | e4 | - | e4 | e3 | e4 |
端子面层 | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
其他特性 | - | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | - |
Factory Lead Time | - | - | 1 week | 1 week | 1 week | 1 week | 1 week | - |
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