EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, MSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Catalyst |
| 零件包装代码 | MSOP |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010XXXR |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 内存密度 | 1024 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 128 words |
| 字数代码 | 128 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 9e-7 A |
| 最大压摆率 | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |

| CAT24C21Z-TE13 | CAT24C21U-TE13 | CAT24C21Y-TE13 | CAT24C21R-TE13 | CAT24C21W-TE13 | CAT24C21ZD4-TE13 | CAT24C21L | CAT24C21J-TE13 | CAT24C21P | CAT24C21RD4-TE13 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, MSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, TSSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8 | EEPROM, 128X8, Serial, CMOS, 3 X 3 MM, LEAD AND HALOGEN FREE, TDFN-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, 3 X 3 MM, TDFN-8 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| 零件包装代码 | MSOP | SOIC | SOIC | MSOP | SOIC | DFN | DIP | SOIC | DIP | DFN |
| 包装说明 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | VSON, SOLCC8,.12,25 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | VSON, SOLCC8,.12,25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR | 1010XXXR |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-XDSO-N8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-XDSO-N8 |
| JESD-609代码 | e3 | e0 | e3 | e0 | e3 | e3 | e3 | e0 | e0 | e0 |
| 长度 | 3 mm | 4.4 mm | 4.4 mm | 3 mm | 4.9 mm | 4.9 mm | 9.59 mm | 4.9 mm | 9.59 mm | 4.9 mm |
| 内存密度 | 1024 bi | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| 字数代码 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | SOP | VSON | DIP | SOP | DIP | VSON |
| 封装等效代码 | TSSOP8,.19 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.19 | SOP8,.25 | SOLCC8,.12,25 | DIP8,.3 | SOP8,.25 | DIP8,.3 | SOLCC8,.12,25 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | 260 | 240 | 260 | 240 | 260 | 260 | 260 | 240 | 240 | 240 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.75 mm | 0.8 mm | 4.57 mm | 1.75 mm | 4.57 mm | 0.8 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A |
| 最大压摆率 | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 30 | 40 | 40 | 40 | 30 | 30 | 30 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3.9 mm | 3 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | - | - | 含铅 | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | - | - | - | 1 |
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