Parity Generator/Checker, CMOS, CDFP14,
参数名称 | 属性值 |
厂商名称 | Aeroflex |
包装说明 | DFP, FL14,.3 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-XDFP-F14 |
逻辑集成电路类型 | PARITY GENERATOR/CHECKER |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL14,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
UT54ACS280-UCC | UT54ACTS280-UCX | UT54ACS280-UCX | UT54ACS280-PCC | UT54ACS280-PCX | UT54ACS280-UCA | UT54ACTS280-PCA | UT54ACTS280-UCC | |
---|---|---|---|---|---|---|---|---|
描述 | Parity Generator/Checker, CMOS, CDFP14, | Parity Generator/Checker, CMOS, CDFP14, | Parity Generator/Checker, CMOS, CDFP14, | Parity Generator/Checker, CMOS, CDIP14, | Parity Generator/Checker, CMOS, CDIP14, | Parity Generator/Checker, CMOS, CDFP14, | Parity Generator/Checker, CMOS, CDIP14, | Parity Generator/Checker, CMOS, CDFP14, |
包装说明 | DFP, FL14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
JESD-30 代码 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 |
逻辑集成电路类型 | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DFP | DFP | DFP | DIP | DIP | DFP | DIP | DFP |
封装等效代码 | FL14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Aeroflex | - | - | Aeroflex | Aeroflex | Aeroflex | Aeroflex | Aeroflex |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved