4 BIT SINGLE CHIP MICROCOMPUTER
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Hitachi (Renesas ) |
| Objectid | 100835059 |
| 包装说明 | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknow |
| compound_id | 182025536 |
| 位大小 | 4 |
| CPU系列 | HMCS400 |
| JESD-30 代码 | R-PDIP-T64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP64,.75 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 16384 |
| ROM可编程性 | EPROM |
| 速度 | 4.5 MHz |
| 最大压摆率 | 6 mA |
| 表面贴装 | NO |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| HD404329S | HD404328 | HD404328FS | HD404328S | HD404329 | HD404329C | HD404329FS | |
|---|---|---|---|---|---|---|---|
| 描述 | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER |
| 厂商名称 | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) |
| 包装说明 | SDIP, SDIP64,.75 | - | QFP, QFP64,.7X.95,40 | DIP, SDIP64,.75 | - | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 |
| Reach Compliance Code | unknow | - | unknow | unknown | - | unknow | unknow |
| 位大小 | 4 | - | 4 | 4 | - | 4 | 4 |
| CPU系列 | HMCS400 | - | HMCS400 | HMCS400 | - | HMCS400 | HMCS400 |
| JESD-30 代码 | R-PDIP-T64 | - | R-PQFP-G64 | R-PDIP-T64 | - | R-XDIP-T64 | R-PQFP-G64 |
| 端子数量 | 64 | - | 64 | 64 | - | 64 | 64 |
| 最高工作温度 | 70 °C | - | 75 °C | 75 °C | - | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | - | -20 °C | -20 °C | - | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SDIP | - | QFP | DIP | - | SDIP | QFP |
| 封装等效代码 | SDIP64,.75 | - | QFP64,.7X.95,40 | SDIP64,.75 | - | SDIP64,.75 | QFP64,.7X.95,40 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | - | FLATPACK | IN-LINE | - | IN-LINE, SHRINK PITCH | FLATPACK |
| 电源 | 3.3/5 V | - | 3/5 V | 3/5 V | - | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| RAM(字节) | 256 | - | 140 | 140 | - | 256 | 256 |
| ROM(单词) | 16384 | - | 8192 | 8192 | - | 16384 | 16384 |
| ROM可编程性 | EPROM | - | MROM | MROM | - | EPROM | EPROM |
| 速度 | 4.5 MHz | - | 0.56 MHz | 0.56 MHz | - | 4.5 MHz | 4.5 MHz |
| 最大压摆率 | 6 mA | - | 6 mA | 6 mA | - | 6 mA | 6 mA |
| 表面贴装 | NO | - | YES | NO | - | NO | YES |
| 温度等级 | COMMERCIAL | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.78 mm | - | 1 mm | 1.778 mm | - | 1.78 mm | 1 mm |
| 端子位置 | DUAL | - | QUAD | DUAL | - | DUAL | QUAD |
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