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25LC128XT-E/SM: 产品描述16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8; 产品类别存储存储; 文件大小509KB，共32页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com

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25LC128XT-E/SM概述

16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8

25LC128XT-E/SM规格参数

参数名称	属性值
零件包装代码	SOIC
包装说明	SOP,
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	10 MHz
JESD-30 代码	R-PDSO-G8
JESD-609代码	e3
长度	5.26 mm
内存密度	131072 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	16384 words
字数代码	16000
工作模式	SYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-40 °C
组织	16KX8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
认证状态	Not Qualified
座面最大高度	2.03 mm
串行总线类型	SPI
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	MATTE TIN
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	5.25 mm
最长写入周期时间 (tWC)	5 ms
Base Number Matches	1

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25AA128/25LC128

128K SPI Bus Serial EEPROM

Device Selection Table

Part Number

25LC128

25AA128

Range

2.5-5.5V

1.8-5.5V

Page Size

64 Byte

Temp. Ranges

I,E

Packages

P, SM, SN, ST, MF

Features:

• Max. Clock 10 MHz

• Low-power CMOS Technology

- Max. Write Current: 5 mA at 5.5V, 10 MHz

- Read Current: 5 mA at 5.5V, 10 MHz

- Standby Current: 5

A

at 5.5V

• 16,384 x 8-bit Organization

• 64 Byte Page

• Self-timed Erase and Write Cycles (5 ms max.)

• Block Write Protection

- Protect none, 1/4, 1/2 or all of array

• Built-in Write Protection

- Power-on/off data protection circuitry

- Write enable latch

- Write-protect pin

• Sequential Read

• High Reliability

- Endurance: 1,000,000 erase/write cycles

- Data retention: > 200 years

- ESD protection: > 4000V

• Temperature Ranges Supported;

- Industrial (I):

-40C to +85C

- Automotive (E):

-40°C to +125°C

• Pb-free and RoHS Compliant

Description:

The Microchip Technology Inc. 25AA128/25LC128

(25XX128

) are 128k-bit Serial Electrically Erasable

PROMs. The memory is accessed via a simple Serial

Peripheral Interface (SPI) compatible serial bus. The

bus signals required are a clock input (SCK) plus sep-

arate data in (SI) and data out (SO) lines. Access to the

device is controlled through a Chip Select (CS) input.

Communication to the device can be paused via the

hold pin (HOLD). While the device is paused,

transitions on its inputs will be ignored, with the

exception of Chip Select, allowing the host to service

higher priority interrupts.

The 25XX128 is available in standard packages

including 8-lead PDIP, SOIJ and SOIC, and

advanced packaging including 8-lead DFN and 8-

lead TSSOP.

Package Types (not to scale)

TSSOP

(ST)

HOLD

SCK

PDIP/SOIC/SOIJ

(P, SM, SN)

25LC128

HOLD

SCK

Pin Function Table

Name

SCK

HOLD

Function

Chip Select Input

Serial Data Output

Write-Protect

Ground

Serial Data Input

Serial Clock Input

Hold Input

Supply Voltage

X-Rotated TSSOP

(X/ST)

HOLD

SCK

DFN

(MF)

CS 1

SO 2

WP 3

25LC128

HOLD

SCK

* 25XX128 is used in this document as a generic part number for the 25AA128, 25LC128 devices.



2003-2011 Microchip Technology Inc.

DS21831E-page 1

25LC128XT-E/SM相似产品对比

	25LC128XT-E/SM	25AA128X-I/SM	25AA128XT-I/SM	25LC128X-E/SM	25LC128XT-I/SM	25LC128X-I/SM	25LC128T-E/SNRVA	25AA128-I/S16K	25AA128-I/W16K	25LC128-I/ST
描述	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	EEPROM, 16KX8, Serial, CMOS, PDSO8	IC EEPROM 128K SPI 10MHZ WAFER	IC EEPROM 128K SPI 10MHZ WAFER	存储器接口类型：SPI 存储器容量：128Kb (16K x 8) 工作电压：2.5V ~ 5.5V 存储器类型：Non-Volatile 128 Kbit(16K x 8)，SPI接口，电压范围：2.5V~5.5V
包装说明	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,	SOP,	DIE,	DIE,	4.40 MM, PLASTIC, TSSOP-8
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compliant	unknown	unknown	compliant
最大时钟频率 (fCLK)	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-XUUC-N	R-XUUC-N	R-PDSO-G8
内存密度	131072 bi	131072 bi	131072 bi	131072 bi	131072 bi	131072 bi	131072 bit	131072 bit	131072 bit	131072 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
字数	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
字数代码	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	125 °C	85 °C	85 °C	125 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8	16KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
封装代码	SOP	SOP	SOP	SOP	SOP	SOP	SOP	DIE	DIE	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	UNCASED CHIP	UNCASED CHIP	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2.5 V	1.8 V	1.8 V	2.5 V	2.5 V	2.5 V	2.5 V	4.5 V	4.5 V	2.5 V
标称供电电压 (Vsup)	5 V	2.5 V	2.5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	UPPER	UPPER	DUAL
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
零件包装代码	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	-	-	-	SOIC
针数	8	8	8	8	8	8	-	-	-	8
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	-	EAR99
JESD-609代码	e3	e3	e3	e3	e3	e3	-	-	-	e3
长度	5.26 mm	5.26 mm	5.26 mm	5.26 mm	5.26 mm	5.26 mm	4.9 mm	-	-	4.4 mm
端子数量	8	8	8	8	8	8	8	-	-	8
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-	Not Qualified
座面最大高度	2.03 mm	2.03 mm	2.03 mm	2.03 mm	2.03 mm	2.03 mm	1.75 mm	-	-	1.2 mm
端子面层	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	-	-	-	Matte Tin (Sn)
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	-	0.65 mm
宽度	5.25 mm	5.25 mm	5.25 mm	5.25 mm	5.25 mm	5.25 mm	3.9 mm	-	-	3 mm
Base Number Matches	1	1	1	1	1	1	1	-	-	1

25LC128XT-E/SM

25LC128XT-E/SM概述

25LC128XT-E/SM规格参数

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25LC128XT-E/SM相似产品对比

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