Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LAPIS Semiconductor Co Ltd |
包装说明 | QFP, QFP44,.53X.57,32 |
Reach Compliance Code | unknow |
位大小 | 8 |
CPU系列 | 8051 |
JESD-30 代码 | R-PQFP-G44 |
JESD-609代码 | e0 |
端子数量 | 44 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP44,.53X.57,32 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 256 |
ROM(单词) | 16384 |
ROM可编程性 | MROM |
速度 | 16 MHz |
最大压摆率 | 23 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
MSM83C154-1GS-VIK | CX12AZ-A1B3C2100-24.0D16-3 | MSM80C154-1JS | MSM80C154JS | MSM80C154-1RS | MSM83C154-1RS | MSM80C154-1GS | |
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描述 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Parallel - 3Rd Overtone Quartz Crystal, 24MHz Nom, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknow | compliant | unknown | unknown | unknown | unknow | unknow |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -10 °C | -20 °C | -40 °C | -20 °C | -20 °C | -20 °C |
表面贴装 | YES | YES | YES | YES | NO | NO | YES |
厂商名称 | LAPIS Semiconductor Co Ltd | - | - | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
包装说明 | QFP, QFP44,.53X.57,32 | - | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 |
位大小 | 8 | - | 8 | 8 | 8 | 8 | 8 |
CPU系列 | 8051 | - | 8051 | 8051 | 8051 | 8051 | 8051 |
JESD-30 代码 | R-PQFP-G44 | - | S-PQCC-J44 | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | S-PQFP-G44 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
端子数量 | 44 | - | 44 | 44 | 40 | 40 | 44 |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | - | QCCJ | QCCJ | DIP | DIP | QFP |
封装等效代码 | QFP44,.53X.57,32 | - | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | QFP44,.5SQ,32 |
封装形状 | RECTANGULAR | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | - | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 256 | - | 256 | 256 | 256 | 256 | 256 |
速度 | 16 MHz | - | 16 MHz | 12 MHz | 16 MHz | 16 MHz | 16 MHz |
最大压摆率 | 23 mA | - | 23 mA | 20 mA | 23 mA | 23 mA | 20 mA |
标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 0.8 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 0.8 mm |
端子位置 | QUAD | - | QUAD | QUAD | DUAL | DUAL | QUAD |
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