Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PQCC8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compli |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | S-PQCC-N8 |
| JESD-609代码 | e4 |
| 长度 | 1.6 mm |
| 逻辑集成电路类型 | INVERTER |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 20.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1.6 mm |
| 74AUP3G04GM | 935292792115 | 74AUP3G04DC | 935280754115 | 935281439125 | 74AUP3G04GT | |
|---|---|---|---|---|---|---|
| 描述 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PQCC8 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PQCC8 | Inverter, AUP/ULP/V Series, 3-Func, 1-Input, CMOS, PDSO8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compli |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | S-PQCC-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-N8 | S-PQCC-N8 | R-PDSO-N8 |
| JESD-609代码 | e4 | e3 | e4 | e3 | e4 | e3 |
| 长度 | 1.6 mm | 1.35 mm | 2.3 mm | 1.95 mm | 1.6 mm | 1.95 mm |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | VSON | VSSOP | VSON | VQCCN | VSON |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 传播延迟（tpd） | 20.9 ns | 20.9 ns | 20.9 ns | 20.9 ns | 20.9 ns | 20.9 ns |
| 座面最大高度 | 0.5 mm | 0.35 mm | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 1.6 mm | 1 mm | 2 mm | 1 mm | 1.6 mm | 1 mm |
| 包装说明 | HVQCCN, | VSON, | - | VSON, | VQCCN, | VSON, |
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