1
Thin-Film Technology
Accu-F / Accu-P
Thin-Film RF/Microwave Capacitors
®
®
5
Accu-F
®
/ Accu-P
®
Thin-Film Technology
THE IDEAL CAPACITOR
The non-ideal characteristics of a real capacitor can be
ignored at low frequencies. Physical size imparts inductance
to the capacitor and dielectric and metal electrodes result in
resistive losses, but these often are of negligible effect on the
circuit. At the very high frequencies of radio communication
(>100MHz) and satellite systems (>1GHz), these effects
become important. Recognizing that a real capacitor will
exhibit inductive and resistive impedances in addition to
capacitance, the ideal capacitor for these high frequencies is
an ultra low loss component which can be fully characterized
in all parameters with total repeatability from unit to unit.
Until recently, most high frequency/microwave capacitors
were based on fired-ceramic (porcelain) technology. Layers
of ceramic dielectric material and metal alloy electrode paste
are interleaved and then sintered in a high temperature oven.
This technology exhibits component variability in dielectric
quality (losses, dielectric constant and insulation resistance),
variability in electrode conductivity and variability in physical
size (affecting inductance). An alternate thin-film technology
has been developed which virtually eliminates these vari-
ances. It is this technology which has been fully incorporated
into Accu-F
®
and Accu-P
®
to provide high frequency capaci-
tors exhibiting truly ideal characteristics.
The main features of Accu-F
®
and Accu-P
®
may be summa-
rized as follows:
• High purity of electrodes for very low and repeatable
ESR.
• Highly pure, low-K dielectric for high breakdown field,
high insulation resistance and low losses to frequencies
above 40GHz.
• Very tight dimensional control for uniform inductance,
unit to unit.
• Very tight capacitance tolerances for high frequency
signal applications.
This accuracy sets apart these Thin-Film capacitors from
ceramic capacitors so that the term Accu has been
employed as the designation for this series of devices, an
abbreviation for “accurate.”
THIN-FILM TECHNOLOGY
Thin-film technology is commonly used in producing semi-
conductor devices. In the last two decades, this technology
has developed tremendously, both in performance and in
process control. Today’s techniques enable line definitions of
below 1µm, and the controlling of thickness of layers at 100Å
(10
-2
µm). Applying this technology to the manufacture of
capacitors has enabled the development of components
where both electrical and physical properties can be tightly
controlled.
The thin-film production facilities at AVX consist of:
• Class 1000 clean rooms, with working areas under
laminar-flow hoods of class 100, (below 100 particles
per cubic foot larger than 0.5µm).
• High vacuum metal deposition systems for high-purity
electrode construction.
• Photolithography equipment for line definition down to
2.0µm accuracy.
• Plasma-enhanced CVD for various dielectric deposi-
tions (CVD=Chemical Vapor Deposition).
• High accuracy, microprocessor-controlled dicing saws
for chip separation.
• High speed, high accuracy sorting to ensure strict
tolerance adherence.
1
TERMINATION
ALUMINA
ELECTRODE
SEAL
ELECTRODE
DIELECTRIC
ALUMINA
ACCU-P
®
CAPACITOR
6
Accu-F
®
/ Accu-P
®
Thin-Film Chip Capacitors
ACCU-F
®
TECHNOLOGY
The use of very low-loss dielectric materials, silicon dioxide
and silicon oxynitride, in conjunction with highly conductive
electrode metals results in low ESR and high Q. These
high-frequency characteristics change at a slower rate with
increasing frequency than for ceramic microwave capacitors.
Because of the thin-film technology, the above-mentioned
frequency characteristics are obtained without significant
compromise of properties required for surface mounting.
The main Accu-F
®
properties are:
• Internationally agreed sizes with excellent dimensional
control.
• Small size chip capacitors (0603) are available.
• Tight capacitance tolerances.
• Low ESR at VHF, UHF and microwave frequencies.
• High stability with respect to time, temperature, frequency
and voltage variation.
• Nickel/solder-coated terminations to provide excellent
solderability and leach resistance.
ACCU-P
®
TECHNOLOGY
As in the Accu-F
®
series the use of very low-loss dielectric
materials (silicon dioxide and silicon oxynitride) in conjunction
with highly conductive electrode metals results in low ESR and
high Q. At high frequency these characteristics change at
a slower rate with increasing frequency than conventional
ceramic microwave capacitors. Using thin-film technology, the
above-mentioned frequency characteristics are obtained with-
out significant compromise of properties required for surface
mounting. The use of high thermal conductivity materials
results in excellent RF power handling capabilities.
The main Accu-P
®
properties are:
• Enhanced RF power handling capability.
• Improved mechanical characteristics.
• Internationally agreed sizes with excellent dimensional control.
• Ultra Small size chip capacitors (0201) are available.
• Tight capacitance tolerances.
• Low ESR at UHF, VHF, and microwave frequencies.
• High-stability with respect to time, temperature, frequency
and voltage variation.
• High temperature nickel/solder-coated terminations as stan-
dard to provide excellent solderability and leach resistance.
1
ACCU-F
®
FEATURES
Accu-F
®
meets the fast-growing demand for low-loss
(high-Q) capacitors for use in surface mount technology espe-
cially for the mobile communications market, such as cellular
radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless
telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and
for other VHF, UHF and microwave applications.
Accu-F
®
is currently unique in its ability to offer very
low capacitance values (0.1pF) and very tight capacitance
tolerances (±0.05pF). Typically Accu-F
®
will be used in small
signal applications in VCO’s, matching networks, filters, etc.
Inspection test and quality control procedures in accordance
with ISO 9001, CECC, IECQ and USA MIL Standards yield
products of the highest quality.
ACCU-P
®
FEATURES
• Minimal batch to batch variability of parameters at high fre-
quency.
• The Accu-P
®
has the same unique features as the Accu-F
®
capacitor such as low ESR, high Q, availability of very low
capacitance values and very tight capacitance tolerances.
• The RF power handling capability of the Accu-P
®
allows for
its usage in both small signal and RF power applications.
• Inspection, test and quality control procedures in accor-
dance with ISO 9001, CECC, IECQ and USA MIL Standards
guarantee product of the highest quality.
• Hand soldering Accu-P
®
: Due to their construction
utilizing relatively high thermal conductivity materials,
Accu-P’s have become the preferred device in R & D labs
and production environments where hand soldering is used.
Accu-P’s are available in all sizes and are electrically identi-
cal to their Accu-F counterparts.
APPLICATIONS
Cellular Communications
CT2/PCN (Cordless
Telephone/Personal Comm.
Networks)
Satellite TV
Cable TV
GPS (Global Positioning Systems)
Vehicle Location Systems
Vehicle Alarm Systems
Paging
Military Communications
Radar Systems
Video Switching
Test & Measurements
Filters
VCO’s
Matching Networks
APPLICATIONS
Cellular Communications
CT2/PCN (Cordless
Telephone/Personal Comm.
Networks)
Satellite TV
Cable TV
GPS (Global Positioning Systems)
Vehicle Location Systems
Vehicle Alarm Systems
Paging
Military Communications
Radar Systems
Video Switching
Test & Measurements
Filters
VCO's
Matching Networks
RF Amplifiers
APPROVALS
ISO 9001
APPROVALS
ISO 9001
7
Accu-F
®
*/ Accu-P
®
Thin-Film Chip Capacitors for
RF Signal and Power Applications
B
1
W
T
B
2
1
L
ACCU-P
®
(Signal and Power Type Capacitors)
0201
0.60±0.05
(0.023±0.002)
0.325±0.050
W
(0.0128±0.002)
0.225±0.050
T
(0.009±0.002)
0.10±0.10
B
1
(0.004±0.004)
0.15±0.05
B
2
(0.006±0.002)
ACCU-F
®
*
(Signal Type Capacitors)
0603
L
W
T
B
1.60±0.1
(0.063±0.004)
0.81±0.1
(0.032±0.004)
0.63±0.1
(0.025±0.004)
0.30±0.1
(0.012±0.004)
0402*
1.00±0.1
(0.039±0.004)
0.55±0.07
(0.022±0.003)
0.40±0.1
(0.016±0.004)
0.00
+0.1
-0.0
(0.000
+0.004
)
-0.000
0.20±0.1
(0.008±0.004)
0603*
1.60±0.1
(0.063±0.004)
0.81±0.1
(0.032±0.004)
0.63±0.1
(0.025±0.004)
0.35±0.15
(0.014±0.006)
0.35±0.15
(0.014±0.006)
0805*
2.01±0.1
(0.079±0.004)
1.27±0.1
(0.050±0.004)
0.93±0.2
(0.036±0.008)
0.30±0.1
(0.012±0.004)
0.30±0.1
(0.012±0.004)
1210
3.02±0.1
(0.119±0.004)
2.5±0.1
(0.100±0.004)
0.93±0.2
(0.036±0.008)
0.43±0.1
(0.017±0.004)
0.43±0.1
(0.017±0.004)
0805
2.01±0.1
(0.079±0.004)
1.27±0.1
(0.050±0.004)
0.63±0.1
(0.025±0.004)
0.30±0.1
(0.012±0.004)
DIMENSIONS:
millimeters (inches)
L
*
Not recommended for new designs.
Accu-P’s are recommended.
*
Mount Black Side Up
A
Tolerance
for
C≤2.0pF*
P = ±0.02pF
Q = ±0.03pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
DIMENSIONS: millimeters (inches)
HOW TO ORDER
0402
Size
0201*
0402*
0603
0805
1210*
* Accu-P ONLY
3
Voltage
1 = 100V
5 = 50V
3 = 25V
Y = 16V
Z = 10V
J
Temperature
Coefficient
(1)
4R7
Capacitance
B
Specification
Code
A = Accu-F
®
technology
B = Accu-P
®
technology
S
Termination
Code
TR
Packaging
Code
Capacitance
J = 0±30ppm/°C expressed in pF.
(-55°C to
(2 significant
+125°C)
digits + number
K = 0±60ppm/°C
of zeros)
(-55°C to
for values
+125°C)
<10pF,
letter R denotes
decimal point.
Example:
68pF = 680
8.2pF = 8R2
for
C≤3.0pF
Q = ±0.03pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
(1)
TC’s shown are per EIA/IEC Specifications.
for
C≤5.6pF
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
W = Nickel/Solder Coated
TR = Tape & Reel
Accu-F
®
Sn63, Pb37
Accu-P
®
0402
Sn90, Pb10
T = Nickel/High Temperature
Solder Coated
Accu-P
®
0805**, 1210**
Sn96, Ag4
Nickel/Solder Coated
Accu-P
®
0603
Sn63, Pb37
**S = Nickel/Lead Free
Solder Coated
Accu-P
®
0201, 0402, 0603
Sn100
**RoHS Compliant
for
5.6pF<C<10pF
RoHS COMPLIANT
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
Pb: Free
Please select correct
termination style
for
C≥10pF
F = ±1%
G = ±2%
J = ±5%
Engineering Kits Available
see pages 90-91
*
Tolerances as tight as ±0.01pF are available. Please consult the factory.
ELECTRICAL SPECIFICATIONS
Operating and Storage Temperature Range
Temperature Coefficients
(1)
Capacitance Measurement
Insulation Resistance (IR)
Proof Voltage
Aging Characteristic
Dielectric Absorption
(1)
-55°C to +125°C
0 ± 30ppm/°C dielectric code “J” / 0 ± 60ppm/°C dielectric code “K”
1 MHz, 1 Vrms
≥10
11
Ohms (≥10
10
Ohms for 0201 and 0402 size)
2.5 U
R
for 5 secs.
Zero
0.01%
TC’s shown are per EIA/IEC Specifications.
8
Accu-F
®
*
Signal Type Capacitors
Accu-F
®
Capacitance Ranges (pF)
TEMP. COEFFICIENT CODE
“J” = 0±30ppm/°C
(-55°C to +125°C)
(2)
Size
Size Code
Voltage
Cap in
pF
(1)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
(1)
TEMP. COEFFICIENT CODE
“K” = 0±60ppm/°C
(-55°C to +125°)
(2)
0805
50
Size
Size Code
Voltage
Cap in
pF
(
(1)
1
100
0603
50
25
100
0805
50
25
100
0603
50
25
100
25
Cap
code
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R2
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
Cap
code
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R2
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
(1)
For capacitance values higher than listed in table,
please consult factory.
TC shown is per EIA/IEC Specifications.
For capacitance values higher than listed in table,
please consult factory.
TC shown is per EIA/IEC Specifications.
(2)
(2)
Intermediate values are available within the indicated range.
*
Not recommended for new designs.
Accu-P’s are recommended.
9
FPGA/CPLD
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