EEPROM, 4KX8, Serial, CMOS, PDSO8, 5 X 6 MM, 1.75 MM HEIGHT, HALOGEN AND LEAD FREE, SOP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ABLIC |
| 零件包装代码 | SOIC |
| 包装说明 | SOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 6.5 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 内存密度 | 32768 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | SPI |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |





| S-25A320B0A-J8T2U3 | S-25A080B0A-K8T2U3 | S-25A320B0A-T8T2U3 | S-25A160B0A-K8T2U3 | S-25A160B0A-J8T2U3 | S-25A160B0A-T8T2U3 | S-25A080B0A-J8T2U3 | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 4KX8, Serial, CMOS, PDSO8, 5 X 6 MM, 1.75 MM HEIGHT, HALOGEN AND LEAD FREE, SOP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 2.90 X 4 MM, 0.80 MM HEIGHT, HALOGEN AND LEAD FREE, TMSOP-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, 3 X 6.40 MM, 1.10 MM HEIGHT, HALOGEN AND LEAD FREE, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, TMSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 5 X 6 MM, 1.75 MM HEIGHT, HALOGEN AND LEAD FREE, SOP-8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
| 零件包装代码 | SOIC | MSOP | SOIC | MSOP | SOIC | SOIC | SOIC |
| 包装说明 | SOP-8 | TMSOP-8 | TSSOP-8 | TMSOP-8 | SOP-8 | TSSOP-8 | SOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 6.5 MHz | 6.5 MHz | 6.5 MHz | 6.5 MHz | 6.5 MHz | 6.5 MHz | 6.5 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 5 mm | 2.9 mm | 4.4 mm | 2.9 mm | 5 mm | 4.4 mm | 5 mm |
| 内存密度 | 32768 bi | 8192 bit | 32768 bit | 16384 bit | 16384 bi | 16384 bi | 8192 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 4096 words | 1024 words | 4096 words | 2048 words | 2048 words | 2048 words | 1024 words |
| 字数代码 | 4000 | 1000 | 4000 | 2000 | 2000 | 2000 | 1000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4KX8 | 1KX8 | 4KX8 | 2KX8 | 2KX8 | 2KX8 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | VSSOP | TSSOP | VSSOP | SOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 1.75 mm | 0.8 mm | 1.1 mm | 0.8 mm | 1.75 mm | 1.1 mm | 1.75 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 2.8 mm | 3 mm | 2.8 mm | 3.9 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
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