Power Management Circuit, CMOS, MBCY8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| JESD-30 代码 | O-MBCY-W8 |
| JESD-609代码 | e0 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | METAL |
| 封装等效代码 | CAN8,.2 |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 标称供电电压 (Vsup) | 5 V |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE |
| 端子位置 | BOTTOM |
| MAX8212CTY/HR | MAX8212ETV | MAX8211CPA-2 | MAX8211CSA2 | MAX8212CPA-2 | MAX8212CSA2 | MAX8212MJA/HR | |
|---|---|---|---|---|---|---|---|
| 描述 | Power Management Circuit, CMOS, MBCY8 | Power Management Circuit, CMOS, MBCY8 | Power Management Circuit, CMOS, PDIP8, DIP-8 | Power Management Circuit, CMOS, PDSO8 | Power Management Circuit, CMOS, PDIP8, DIP-8 | Power Management Circuit, CMOS, PDSO8 | Power Management Circuit, CMOS, CDIP8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | O-MBCY-W8 | O-MBCY-W8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-XDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装等效代码 | CAN8,.2 | CAN8,.2 | DIP8,.3 | SOP8,.25 | DIP8,.3 | SOP8,.25 | DIP8,.3 |
| 封装形状 | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CYLINDRICAL | CYLINDRICAL | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE | WIRE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子位置 | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | - | 0.02 mA | - | 0.02 mA | - | 0.02 mA | 0.02 mA |
| 封装代码 | - | - | DIP | SOP | DIP | SOP | DIP |
| 表面贴装 | - | - | NO | YES | NO | YES | NO |
| 端子节距 | - | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
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