Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP65R045C7
MA001043890
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
15.501
0.816
0.245
815.335
7.696
5.789
109.994
463.133
21.462
0.244
0.001
0.648
1.619
4.210
0.590
0.177
589.466
Average
Mass
[%]
0.76
0.04
0.01
40.03
0.38
0.28
5.40
22.74
1.05
0.01
0.00
0.03
0.08
0.21
0.03
0.01
28.94
29. August 2013
2036.93 mg
Sum
[%]
0.76
Average
Mass
[ppm]
7610
401
120
40.08
0.38
400277
3778
2842
54000
28.42
1.05
227368
10537
120
0.01
1
318
795
0.32
2067
290
87
28.98
289389
289766
1000000
3180
120
284210
10537
400799
3778
Sum
[ppm]
7610
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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