High Voltage 1A Peak Half Bridge Gate Driver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | MS-012AA, SOIC-8 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 高边驱动器 | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 标称输出峰值电流 | 1 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 | 14 V |
| 最小供电电压 | 8 V |
| 标称供电电压 | 12 V |
| 表面贴装 | YES |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 断开时间 | 0.056 µs |
| 接通时间 | 0.056 µs |
| 宽度 | 3.9 mm |
| LM5109BMA | LM5109B | LM5109BMAX | LM5109BSD | LM5109BSDX | |
|---|---|---|---|---|---|
| 描述 | High Voltage 1A Peak Half Bridge Gate Driver | High Voltage 1A Peak Half Bridge Gate Driver | High Voltage 1A Peak Half Bridge Gate Driver | High Voltage 1A Peak Half Bridge Gate Driver | High Voltage 1A Peak Half Bridge Gate Driver |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 包装说明 | MS-012AA, SOIC-8 | - | MS-012AA, SOIC-8 | 4 X 4 MM, LLP-8 | 4 X 4 MM, LLP-8 |
| Reach Compliance Code | _compli | - | _compli | _compli | _compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | YES | - | YES | YES | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | - | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | R-PDSO-G8 | - | R-PDSO-G8 | S-XDSO-N8 | S-XDSO-N8 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 长度 | 4.9 mm | - | 4.9 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 8 | - | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 标称输出峰值电流 | 1 A | - | 1 A | 1 A | 1 A |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SOP | - | SOP | HVSON | HVSON |
| 封装等效代码 | SOP8,.25 | - | SOP8,.25 | SOLCC8,.15,32 | SOLCC8,.15,32 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 | - | 235 | 260 | 260 |
| 电源 | 12 V | - | 12 V | 12 V | 12 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | - | 1.75 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 | 14 V | - | 14 V | 14 V | 14 V |
| 最小供电电压 | 8 V | - | 8 V | 8 V | 8 V |
| 标称供电电压 | 12 V | - | 12 V | 12 V | 12 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | - | 1.27 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 40 | 40 |
| 断开时间 | 0.056 µs | - | 0.056 µs | 0.056 µs | 0.056 µs |
| 接通时间 | 0.056 µs | - | 0.056 µs | 0.056 µs | 0.056 µs |
| 宽度 | 3.9 mm | - | 3.9 mm | 4 mm | 4 mm |
| Base Number Matches | - | - | 1 | 1 | 1 |
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