75 MHz Dual Clock Buffer
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | LLP-8 |
| Reach Compliance Code | unknow |
| 系列 | 2180 |
| 输入调节 | STANDARD |
| JESD-30 代码 | S-XDSO-N8 |
| JESD-609代码 | e1 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 反相输出次数 | |
| 端子数量 | 8 |
| 实输出次数 | 2 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 2.5/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |
| 最小 fmax | 75 MHz |
| Base Number Matches | 1 |
| LMH2180YDX | LMH2180 | LMH2180SD | LMH2180YD | LMH2180SDX | |
|---|---|---|---|---|---|
| 描述 | 75 MHz Dual Clock Buffer | 75 MHz Dual Clock Buffer | 75 MHz Dual Clock Buffer | 75 MHz Dual Clock Buffer | 75 MHz Dual Clock Buffer |
| 是否Rohs认证 | 符合 | - | 不符合 | 符合 | 不符合 |
| 包装说明 | LLP-8 | - | LLP-8 | LLP-8 | LLP-8 |
| Reach Compliance Code | unknow | - | not_compliant | unknow | compli |
| 系列 | 2180 | - | 2180 | 2180 | 2180 |
| 输入调节 | STANDARD | - | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | S-XDSO-N8 | - | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 |
| JESD-609代码 | e1 | - | e0 | e1 | e0 |
| 长度 | 3 mm | - | 3 mm | 3 mm | 3 mm |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | - | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
| 湿度敏感等级 | 1 | - | 1 | 1 | - |
| 功能数量 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 8 | - | 8 | 8 | 8 |
| 实输出次数 | 2 | - | 2 | 2 | 2 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVSON | - | HVSON | HVSON | HVSON |
| 封装等效代码 | SOLCC8,.11,20 | - | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 最小供电电压 (Vsup) | 2.4 V | - | 2.4 V | 2.4 V | 2.4 V |
| 标称供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Lead (Sn85Pb15) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm |
| 最小 fmax | 75 MHz | - | 75 MHz | 75 MHz | 75 MHz |
| Base Number Matches | 1 | - | - | 1 | 1 |
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