TW
Hybrid D’Sub series
DESCRIPTION
CONTENTS
Specifications
UL file: E64911 - CSA file: LR57744
Connectors according to: MIL C24308 - NFC93425 - HE507
Materials and platings
Electrical Data
7.5 A. with 10 A. peaks
Shells
Steel - Tin plating or yellow chromate
Current rating
Signal contacts
Insulators
High temperature black thermoplastic
Signal contacts
Female: machined bronze
Power contacts
Material
Plating finish
Or
The new Amphenol D’Sub TW
Hybrid Series permits a mix of
contacts including signal, power,
shielded, high voltage and fiber
optics in the same housing with
18 different contacts arrangements.
This new economic series was
developed from combination military
series, and has improved features:
- new contacts
- new high temperature black
thermoplastic insert
- PCB configurations come preloaded
with fixed contacts and brackets.
These connectors are supplied with
screw - machined contacts which are
fixed in the insulator.
A complete range of housings in also
available for cable application.
PCB terminations
10 to 40 A.
Male: machined brass
Solder cup terminations
10 to 40 A.
16µ “Au over 79µ“ Ni min.
Crimp terminations
10 to 40 A.
30µ “Au over 79µ“ Ni min.
Shielded contacts
0.5 A.
Shielded contacts
Female: machined bronze
Voltage rating
Material
Male: machined brass
Signal and power contacts
300 V. R. M. S. at 50 Hz
Shielded contacts
150 V. R. M. S. at 50 Hz
Plating
Inner conductor
16µ “Au or 30µm Au over 79µ“ Ni
Shielded contacts
Outer ring
10µ “Au over 79µ“ Ni
Frequency range
0 - 1 GHz
Terminations
Tinned
Attenuation
0.2 dB
Except solder cup and crimp terminations
gold flash
V.S.W.R.
1.4 (+ 0.04/GHz)
Characteristic impedance
50 Ohms
Power contacts
Female: machined bronze
Material
Male: machined brass
Dielectric withstanding
≥
1000 V.R.M.S. at 50Hz
voltage
Plating
Contacts
16µ “Au or 30µ“ Au over 79µ“ Ni
Insulation resistance
≥
5000 M Ohms at 500 VDC
Terminations
Tinned
≤
5m Ohms
Except solder cup and crimp terminations
gold flash
Contact resistance
≤
1m Ohm
Brackets
Steel - Tin plating or yellow chromate
Shell resistance
Front jackscrews
Brass - Tin plating or yellow chromate
Rear clinch nuts
Brass - Tin plating or yellow chromate
Boardlocks
Bronze - Tin plating
Stand - off
Brass - Tin plating
(electrical grounding)
Climatic Data
Operating temperature
- 55°C + 155°C
(with peaks up to 180°C)
Damp heat
56 days (40°C - 95% HR)
Salt spray
48 hours
APPLICATIONS
Mechanical data
Shells
With or without dimples
Contact retention force in dielectric material
> 40N
Maximum mating and unmating force
With dimples
E size = 70 N
A size = 80 N
B size = 100 N
C size = 150 N
D size = 180 N
Without dimples
E size = 30 N
A size = 50 N
B size = 80 N
C size = 120 N
D size = 160 N
Compatible with process
IR - Air convectioned
260° for 20 s.
Resistance to solder iron heat
260° C for 30 s.
Mating cycles
≥
200 (classe II) or 500 (classe I)
Blind mating system
Available upon request
Polarization
Available with locking accessories
Consult factory
A full range of
arrangements
compatible with
reflow process
•
•
•
•
Industrial
Military
Telecom
Any application requiring
optimization of space
E1/B
TW / E1
TECHNICAL DATAS
Shells and contacts plating
CLASS II
0.4µm (16µ‘‘) Au contacts gold plating
200 mating cycles
CLASS I
0.76µm (30µ‘‘) Au contacts gold plating
500 mating cycles
Types
17 TW
77 TW
717 TW
Shells and plating
Yellow chromated shell
Male and female
Types
117 TW
177 TW
777 TW
Shells and plating
Yellow chromated shell
Male and female
Tin plated shell
Male and female
Tin plated shell
Male and female
Tin plated shell with dimples
Male only
NOTE: Tin plated shells standard
Tin plated shell with dimples
Male only
NOTE: Tin plated shells standard
Housing arrangements
Male front view
Arrangement
Shell size
E
A
A
Arrangement
Shell size
A
B
B
Arrangement
Shell size
B
B
B
Arrangement
Shell size
C
C
C
Arrangement
Shell size
C
C
C
Arrangement
Shell size
D
D
D
2
TECHNICAL DATAS
Straight connector footprint
Signal tail 0.6 mm Dia. (.0236“)
1.6 mm (.063“)PCB
For other PCB thickness: consult factory.
Description
a
Power (.126“ tail dia.)
Power (.0787“ tail dia.)
Shielded
Signal
1
1
3
2
Dimensions
b
7.2 mm
(.283“)
7.2 mm
(.283“)
7.2 mm
(.283“)
11.50 mm
(.453“)
4.50 mm
(.177“)
4.50 mm
(.177“)
4.00 mm
(.157“)
5.00 mm
(.196“)
Straight contact combinations
Arrangement with signal contacts
Arrangement without signal contacts
3W3 - 5W5 - 8W8
See above dimensions
Size 8 and 20 Contacts
See above dimensions
Size 8 Contacts
➡
P 3SY
Power 3.2 mm DIA. (.126“)
(20 to 40 A) and signal
Power 2 mm DIA. (.0787“)
(10 to 20 A) and signal
P 2Y
CSY
SY
No reference
Shielded and signal
Signal only
Signal (Size 20)
with solder cup terminations
Housing preloaded with contacts
➡
P 3Y
Power only
3.2 mm DIA. (.126”)
(20 to 40 A)
Power only
2 mm DIA. (.0787”)
(10 to 20 A)
4
CY
Shielded only
P 2SY
Right angle connector footprint
Signal tail 0.6 mm Dia. (.0236“)
1.6 mm (.063“) PCB
For other PCB thickness: consult factory.
Europe
HE 5 pattern =
- Europ. height
- Europ. footprint
pitch between
2 rows: .100”
Mix
Mixed pattern =
- MIL height
- Europ. footprint
pitch between
2 rows: .100”
MIL
MIL pattern =
- MIL height
- MIL footprint
pitch between
2 rows: .112”
Description
Shielded
Signal
Power (.0787“ tail dia.)
Power (.126“ tail dia.)
1
2
a
-
b
-
c
-
a
b
c
a
b
c
10.30mm 6.30mm 10.00mm 10.30mm 6.30mm 10.00mm
(.406”) (.248”) (.394”) (.406”) (.248”) (.394”)
10.30mm 7.20mm 11.20mm 10.30mm 6.30mm 9.50mm 8.10mm 6.30mm 9.50mm
(.406“) (.283“) (.441”) (.406”) (.248”) (.374”) (.319”) (.248”) (.374”)
11.57mm 7.20mm 10.50mm 11.57mm 6.30mm 9.50mm 9.52mm 6.30mm 9.50mm
21.46mm 7.20mm 10.50mm 21.46mm 6.30mm 9.50mm 21.46mm 6.30mm 9.50mm
3
(.456“) (.283“) (.413”) (.456”) (.248”) (.374”) (.375”) (.248”) (.374”)
3
(.845“) (.283“) (.413”) (.845”) (.248”) (.374”) (.845”) (.248”) (.374”)
Note: above dimensions correpond to sizes E to C. Consult factory for D sizes.
Connector comes equiped with contacts and brackets.
Right angle contacts combinations
Arrangements with signal contacts
Arrangement without signal contacts
3W3 - 5W5 - 8W8
European
footprint
Mixed
footprint
MIL (U.S.)
footprint
Size 8 and
20 contacts
European
footprint
Mixed
footprint
MIL (U.S.)
footprint
Size 8 contacts
only
EP3SV
HP3SV
MP3SV
Power 3.2 mm
DIA. (.126”) (20 to
40 A) and signal
Power 2 mm
DIA. (.0787”) (10 to
20 A) and signal
Shielded and signal
Signal only
EP3V
HP3V
MP3V
Power only
3.2 mm DIA. (.126”)
(20 to 40 A)
Power only
2.0 mm DIA. (0.0787)
(10 to 20 A)
Shielded only
5
EP2SV
HP2SV
MP2SV
EP2V
HP2V
MP2V
-
ESV
HCSV
HSV
MCSV
MSV
-
HCV
MCV
TW / E1
TECHNICAL DATAS
CO
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Microchip MCU
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