Ceramic Capacitor, Multilayer, Ceramic, 25V, 2% +Tol, 2% -Tol, C0G, 30ppm/Cel TC, 0.000091uF, Surface Mount, 0201, CHIP, ROHS COMPLIANT
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Nichicon(尼吉康) |
包装说明 | , 0201 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
电容 | 0.000091 µF |
电容器类型 | CERAMIC CAPACITOR |
介电材料 | CERAMIC |
JESD-609代码 | e3 |
制造商序列号 | NMC |
安装特点 | SURFACE MOUNT |
多层 | Yes |
负容差 | 2% |
端子数量 | 2 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装形状 | RECTANGULAR PACKAGE |
包装方法 | TR, EMBOSSED PLASTIC |
正容差 | 2% |
额定(直流)电压(URdc) | 25 V |
尺寸代码 | 0201 |
表面贴装 | YES |
温度特性代码 | C0G |
温度系数 | -/+30ppm/Cel ppm/°C |
端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier |
端子形状 | WRAPAROUND |
NMC0201NPO910G25TRPLP3KF | NMC0201NPO910F25TRPLP3KF | NMC0201NPO240F25TRPLP3KF | NMC0201NPO240F25TRPLPF | |
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描述 | Ceramic Capacitor, Multilayer, Ceramic, 25V, 2% +Tol, 2% -Tol, C0G, 30ppm/Cel TC, 0.000091uF, Surface Mount, 0201, CHIP, ROHS COMPLIANT | Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000091uF, Surface Mount, 0201, CHIP, ROHS COMPLIANT | Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000024uF, Surface Mount, 0201, CHIP, ROHS COMPLIANT | Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000024uF, Surface Mount, 0201, CHIP, ROHS COMPLIANT |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Nichicon(尼吉康) | Nichicon(尼吉康) | Nichicon(尼吉康) | Nichicon(尼吉康) |
包装说明 | , 0201 | , 0201 | , 0201 | , 0201 |
Reach Compliance Code | compliant | compliant | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
电容 | 0.000091 µF | 0.000091 µF | 0.000024 µF | 0.000024 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
JESD-609代码 | e3 | e3 | e3 | e3 |
制造商序列号 | NMC | NMC | NMC | NMC |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
多层 | Yes | Yes | Yes | Yes |
负容差 | 2% | 1% | 1% | 1% |
端子数量 | 2 | 2 | 2 | 2 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
包装方法 | TR, EMBOSSED PLASTIC | TR, EMBOSSED PLASTIC | TR, EMBOSSED PLASTIC | TR, EMBOSSED PLASTIC |
正容差 | 2% | 1% | 1% | 1% |
额定(直流)电压(URdc) | 25 V | 25 V | 25 V | 25 V |
尺寸代码 | 0201 | 0201 | 0201 | 0201 |
表面贴装 | YES | YES | YES | YES |
温度特性代码 | C0G | C0G | C0G | C0G |
温度系数 | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C |
端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrie | Matte Tin (Sn) - with Nickel (Ni) barrie |
端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
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