1MX1 STATIC COLUMN DRAM, 70ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | STATIC COLUMN |
| 最长访问时间 | 70 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 长度 | 22.1 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | STATIC COLUMN DRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 18 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 4.57 mm |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MCM511002AP70 | MCM511002AZ10 | MCM511002AP80 | MCM511002AJ10 | MCM511002AZ80 | |
|---|---|---|---|---|---|
| 描述 | 1MX1 STATIC COLUMN DRAM, 70ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | 1MX1 STATIC COLUMN DRAM, 100ns, PZIP20, 2.54 MM PITCH, PLASTIC, ZIP-20 | 1MX1 STATIC COLUMN DRAM, 80ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | 1MX1 STATIC COLUMN DRAM, 100ns, PDSO20, 0.300 INCH, PLASTIC, SOJ-20 | 1MX1 STATIC COLUMN DRAM, 80ns, PZIP20, 2.54 MM PITCH, PLASTIC, ZIP-20 |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | DIP, DIP18,.3 | 2.54 MM PITCH, PLASTIC, ZIP-20 | 0.300 INCH, PLASTIC, DIP-18 | 0.300 INCH, PLASTIC, SOJ-20 | 2.54 MM PITCH, PLASTIC, ZIP-20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN |
| 最长访问时间 | 70 ns | 100 ns | 80 ns | 100 ns | 80 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T18 | R-PZIP-T20 | R-PDIP-T18 | R-PDSO-J20 | R-PZIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 22.1 mm | 25.715 mm | 22.1 mm | 17.145 mm | 25.715 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM | STATIC COLUMN DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 20 | 18 | 20 | 20 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | ZIP | DIP | SOJ | ZIP |
| 封装等效代码 | DIP18,.3 | ZIP20,.1 | DIP18,.3 | SOJ20/26,.34 | ZIP20,.1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 4.57 mm | 10.16 mm | 4.57 mm | 3.75 mm | 10.16 mm |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.08 mA | 0.06 mA | 0.07 mA | 0.06 mA | 0.07 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG |
| 宽度 | 7.62 mm | 2.85 mm | 7.62 mm | 7.62 mm | 2.85 mm |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| Base Number Matches | - | 1 | 1 | 1 | - |
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