Standard SRAM, 512KX8, 15ns, CMOS, PDSO44, 0.400 INCH, SOJ-44
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Mosel Vitelic Corporation ( MVC ) |
零件包装代码 | SOJ |
包装说明 | SOJ, SOJ44,.44 |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 15 ns |
其他特性 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J44 |
JESD-609代码 | e0 |
长度 | 25.58 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ44,.44 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.76 mm |
最大待机电流 | 0.00015 A |
最小待机电流 | 2 V |
最大压摆率 | 0.21 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
V61C51164096-15K | V61C51164096-20T | V61C51164096-25K | V61C51164096-15T | V61C51164096-20K | V61C51164096-25T | |
---|---|---|---|---|---|---|
描述 | Standard SRAM, 512KX8, 15ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 512KX8, 20ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | Standard SRAM, 512KX8, 25ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 512KX8, 15ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | Standard SRAM, 512KX8, 20ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 512KX8, 25ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 |
包装说明 | SOJ, SOJ44,.44 | TSOP2, TSOP44,.46,32 | SOJ, SOJ44,.44 | TSOP2, TSOP44,.46,32 | SOJ, SOJ44,.44 | TSOP2, TSOP44,.46,32 |
针数 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 15 ns | 20 ns | 25 ns | 15 ns | 20 ns | 25 ns |
其他特性 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 | TTL COMPATIBLE INPUT/OUTPUT; CAN ALSO BE CONFIGURED AS 256K X 16 |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-G44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 25.58 mm | 18.41 mm | 25.58 mm | 18.41 mm | 25.58 mm | 18.41 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 |
封装等效代码 | SOJ44,.44 | TSOP44,.46,32 | SOJ44,.44 | TSOP44,.46,32 | SOJ44,.44 | TSOP44,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.76 mm | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm | 1.2 mm |
最大待机电流 | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.21 mA | 0.21 mA | 0.21 mA | 0.21 mA | 0.21 mA | 0.21 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | GULL WING | J BEND | GULL WING | J BEND | GULL WING |
端子节距 | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | - | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) |
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