Datasheet> 器件分类 > 无源元件> 晶体/谐振器> FK13LEIBM0.032768-T3

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FK13LEIBM0.032768-T3: 产品描述Parallel - Fundamental Quartz Crystal,; 产品类别无源元件晶体/谐振器; 文件大小277KB，共3页; 制造商FOX [Fox Electronics]; 标准

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FK13LEIBM0.032768-T3概述

Parallel - Fundamental Quartz Crystal,

FK13LEIBM0.032768-T3规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	FOX [Fox Electronics]
包装说明	SMD, 2 PIN
Reach Compliance Code	compliant
Factory Lead Time	16 weeks
老化	3 PPM/YEAR
晶体/谐振器类型	PARALLEL - FUNDAMENTAL
驱动电平	0.1 µW
频率稳定性	0.0144%
频率容差	20 ppm
JESD-609代码	e4
负载电容	6 pF
安装特点	SURFACE MOUNT
标称工作频率	0.032768 MHz
最高工作温度	85 °C
最低工作温度	-40 °C
物理尺寸	3.2mm x 1.5mm x 0.9mm
串联电阻	50000 Ω
表面贴装	YES
端子面层	Gold (Au) - with Nickel (Ni) barrier

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3.2 x 1.5mm SMD Tuning Fork, Low ESR

(former FX135L)

K13L

Page 1 of 3

DATASHEET

STANDARD SPECIFICATIONS

PARAMETERS

Frequency

Frequency Tolerance @ 25ºC

Frequency Stability

(Temperature Coefficient)

Temperature Range

Turnover (T

)

Operating (T

OPR

)

Storage

STG

)

Equivalent Series Resistance (R

)

Load Capacitance (C

)

Insulation Resistance @ 100V

Drive Level

Aging per year

Maximum Soldering Temp / Time

Moisture Sensitivity Level (MSL)

Termination Finish

Seal Method

Lead (Pb) Free

RoHS/Reach Compliant

MAX

(unless otherwise noted)

32.768 kHz

(See options on page 2)

-0.04 PPM / (∆ºC)

+20ºC ~ +30ºC

-40°C ~ +85°C

-55ºC ~ +125ºC

50 kΩ

(See options on page 2)

500MΩ Min

1.0µW

0.1µW Typ

±3 PPM

260ºC / 10 Seconds x2

Au over Ni

Seam

Yes

Temperature Coefficient

°C

‐20

‐40

‐60

‐80

‐100

‐120

‐140

‐160

‐180

‐40 ‐25 ‐10 5 20 35 50 65 80

ppm

Note: Dimensional drawing is for reference to critical

specifications defined by size measurements. Certain non-

critical visual attributes, such as side castellations, etc. may

Title / Description:

K13L STANDARD SPECIFICATIONS

Drawing Number:

K13L-DOC-1

Size: A

Part Number:

Cage:

61429

Draftsperson:

BEC

Approved:

MAJ

Revision Date:

10/17/2019

3.2 x 1.5mm SMD Tuning Fork, Low ESR

(former FX135L)

K13L

Page 3 of 3

DATASHEET

Crystal Unit Handling Precautions

1) Mounting Precautions

• If the board is deformed, such as bending after mounting, peeling of the soldered joint between the crystal

resonator and board may occur producing a crack in the ceramic package, leading to loss of vacuum,

destruction of the internal element, etc. Especially when depaneling the board on which it is mounted, there is a

possibility that a large stress may be applied, please consider board layout and cutting method to minimize

stress on products.

• When the product is automatically mounted on the board, if a large impact is applied to the crystal resonator,

there is a possibility that characteristics may change / deteriorate, or the product may be broken. When

mounting automatically, please set conditions considering the shock to the crystal unit. Also, please conduct the

mounting test beforehand and confirm that there is no influence on the characteristics to the crystal resonator.

• Cracks may occur in the soldered part by repeated harsh temperature changes for a long time when mounting

due to the board having a expansion coefficient different from that of the ceramics used in the crystal package.

When using under such circumstances, please conduct test beforehand and confirm that there is no influence

on the crystal unit.

• Ceramic packages are small and thin products. So, if/when you rework after mounting, please give

consideration to the selection and handling of the tools to be used.

2) Soldering

Following is typical SMD Pb-free reflow profile for soldering:

Excessive heating time at high temperature may result in deterioration of the characteristics and may break the

crystal unit. For manual rework, heat the lead part at 300℃ or lower for 5 seconds or less.

3) Cleaning

Since a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an

ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning.

Title / Description:

K13L STANDARD SPECIFICATIONS

Drawing Number:

K13L-DOC-1

Size: A

Part Number:

Cage:

61429

Draftsperson:

BEC

Approved:

MAJ

Revision Date:

10/17/2019

FK13LEIBM0.032768-T3相似产品对比

	FK13LEIBM0.032768-T3	FK13LEIHM0.032768-T3	FK13LEIVM0.032768-T3
描述	Parallel - Fundamental Quartz Crystal,	Parallel - Fundamental Quartz Crystal,	Parallel - Fundamental Quartz Crystal,
是否Rohs认证	符合	符合	符合
厂商名称	FOX [Fox Electronics]	FOX [Fox Electronics]	FOX [Fox Electronics]
Reach Compliance Code	compliant	compliant	compliant
Factory Lead Time	16 weeks	16 weeks	16 weeks
晶体/谐振器类型	PARALLEL - FUNDAMENTAL	PARALLEL - FUNDAMENTAL	PARALLEL - FUNDAMENTAL
JESD-609代码	e4	e4	e4
端子面层	Gold (Au) - with Nickel (Ni) barrier	Gold (Au) - with Nickel (Ni) barrier	Gold (Au) - with Nickel (Ni) barrier
包装说明	SMD, 2 PIN	SMD, 2 PIN	-
老化	3 PPM/YEAR	3 PPM/YEAR	-
驱动电平	0.1 µW	0.1 µW	-
频率稳定性	0.0144%	0.0144%	-
频率容差	20 ppm	20 ppm	-
负载电容	6 pF	12.5 pF	-
安装特点	SURFACE MOUNT	SURFACE MOUNT	-
标称工作频率	0.032768 MHz	0.032768 MHz	-
最高工作温度	85 °C	85 °C	-
最低工作温度	-40 °C	-40 °C	-
物理尺寸	3.2mm x 1.5mm x 0.9mm	3.2mm x 1.5mm x 0.9mm	-
串联电阻	50000 Ω	50000 Ω	-
表面贴装	YES	YES	-

FK13LEIBM0.032768-T3

FK13LEIBM0.032768-T3概述

FK13LEIBM0.032768-T3规格参数

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FK13LEIBM0.032768-T3相似产品对比

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