4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP18
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 85 Cel |
| 额定供电电压 | 15 V |
| 加工封装描述 | PLASTIC, DIP-18 |
| each_compli | Yes |
| 状态 | Active |
| 模拟IC其它类型 | DIFFERENTIAL MULTIPLEXER |
| jesd_30_code | R-PDIP-T18 |
| jesd_609_code | e0 |
| moisture_sensitivity_level | 1 |
| 额定负供电电压 | -15 V |
| 通道数 | 4 |
| 关闭状态下的隔离额定值 | 68 dB |
| 正向导通电阻匹配额定值 | 300 ohm |
| 最大通态电阻 | 3000 ohm |
| 包装材料 | PLASTIC/EPOXY |
| ckage_code | DIP |
| ckage_equivalence_code | DIP18,.3 |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | IN-LINE |
| eak_reflow_temperature__cel_ | 245 |
| wer_supplies__v_ | +-15 |
| qualification_status | COMMERCIAL |
| seated_height_max | 4.57 mm |
| signal_current_max | 0.0200 A |
| sub_category | Multiplexer or Switches |
| supply_current_max__isup_ | 2.5 mA |
| 表面贴装 | NO |
| 最大关断时间 | 1 ns |
| 最大接通时间 | 1 ns |
| switching__v_ | BREAK-BEFORE-MAKE |
| 工艺 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子涂层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子间距 | 2.54 mm |
| 端子位置 | DUAL |
| ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED |
| length | 22.86 mm |
| width | 7.62 mm |
| dditional_feature | FAULT PROTECTED; OVERVOLTAGE PROTECTION |
| MAX389 | MAX388-MAX389 | MAX389C/D | MAX388 | |
|---|---|---|---|---|
| 描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP18 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP18 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP18 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP18 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 |
| 表面贴装 | NO | NO | YES | NO |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | UPPER | DUAL |
| 最小工作温度 | -40 Cel | -40 Cel | - | -40 Cel |
| 最大工作温度 | 85 Cel | 85 Cel | - | 85 Cel |
| 额定供电电压 | 15 V | 15 V | - | 15 V |
| 加工封装描述 | PLASTIC, DIP-18 | PLASTIC, DIP-18 | - | PLASTIC, DIP-18 |
| each_compli | Yes | Yes | - | Yes |
| 状态 | Active | Active | - | Active |
| 模拟IC其它类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER |
| jesd_30_code | R-PDIP-T18 | R-PDIP-T18 | - | R-PDIP-T18 |
| jesd_609_code | e0 | e0 | - | e0 |
| moisture_sensitivity_level | 1 | 1 | - | 1 |
| 额定负供电电压 | -15 V | -15 V | - | -15 V |
| 通道数 | 4 | 4 | - | 4 |
| 关闭状态下的隔离额定值 | 68 dB | 68 dB | - | 68 dB |
| 正向导通电阻匹配额定值 | 300 ohm | 300 ohm | - | 300 ohm |
| 最大通态电阻 | 3000 ohm | 3000 ohm | - | 3000 ohm |
| 包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| ckage_code | DIP | DIP | - | DIP |
| ckage_equivalence_code | DIP18,.3 | DIP18,.3 | - | DIP18,.3 |
| 包装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 包装尺寸 | IN-LINE | IN-LINE | - | IN-LINE |
| eak_reflow_temperature__cel_ | 245 | 245 | - | 245 |
| wer_supplies__v_ | +-15 | +-15 | - | +-15 |
| qualification_status | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| seated_height_max | 4.57 mm | 4.57 mm | - | 4.57 mm |
| signal_current_max | 0.0200 A | 0.0200 A | - | 0.0200 A |
| sub_category | Multiplexer or Switches | Multiplexer or Switches | - | Multiplexer or Switches |
| supply_current_max__isup_ | 2.5 mA | 2.5 mA | - | 2.5 mA |
| 最大关断时间 | 1 ns | 1 ns | - | 1 ns |
| 最大接通时间 | 1 ns | 1 ns | - | 1 ns |
| switching__v_ | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| 工艺 | CMOS | CMOS | - | CMOS |
| 端子涂层 | TIN LEAD | TIN LEAD | - | TIN LEAD |
| 端子间距 | 2.54 mm | 2.54 mm | - | 2.54 mm |
| ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| length | 22.86 mm | 22.86 mm | - | 22.86 mm |
| width | 7.62 mm | 7.62 mm | - | 7.62 mm |
| dditional_feature | FAULT PROTECTED; OVERVOLTAGE PROTECTION | FAULT PROTECTED; OVERVOLTAGE PROTECTION | - | FAULT PROTECTED; OVERVOLTAGE PROTECTION |
stm32/stm8
51单片机
微控制器 MCU
单片机
嵌入式系统
嵌入式系统
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