MASW6030G
GaAs DPDT Switch
DC - 6.0 GHz
Features
•
•
•
•
Low Insertion Loss, 0.5 dB Typical
Fast Switching Speed, 4 ns Typical
Ultra Low DC Power Consumption
RoHS* Compliant
Rev. V3
Pad Layout
Description
MA/COM’s MASW6030G is a GaAs MMIC DPDT
switch die. The MASW6030G is ideally used where
low power consumption is required.
Typical applications include transmit / receive
switching, switch matrices and switched filter banks,
WLAN IEEE 802.11a and 802.11 b/g systems.
Other applications include cordless phones and
base stations.
Ordering Information
Part Number
MASW6030G
1. Die quantity varies.
Die Size - Inches (mm)
Package
DIE
1
0.048 x 0.038 x 0.010 (1.220 x 0.970 x 0.250)
Bond Pad Dimensions
Bond Pad
RF1, RF6
RF2, RF3, RF4, RF5, A, B
GND
Dimensions - Inches (mm)
0.005 x 0.005 (0.130 x 0.150)
0.004 x 0.004 (0.100 x 0.100)
0.005 x 0.013 (0.130 x 0.320)
Absolute Maximum Rating
2,3
Parameter
Control Value (A or B)
Max Input RF Power
Storage Temperature
Max Operating Temperature
Absolute Maximum
0/-8 V
+34 dBm
(0.5 - 6.0 GHz with 0/-8 V CTL)
-65°C to +175°C
+175°C
Schematic
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. M/A-COM does not recommend sustained operation near
these survivability limits.
Truth Table
4,5
RF1 to
A
1
0
RF6 to
RF4
On
Off
B
0
1
RF2
On
Off
RF3
Off
On
RF5
Off
On
4. 0 = 0 to –0.2 V, 1 = -5 V.
5. When an RF output port is “Off” it is shorted to ground
through an “On” shunt MESFET.
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
1
changes to the product(s) or information contained herein without notice.
MASW6030G
GaAs DPDT Switch
DC - 6.0 GHz
Electrical Specifications: +25°C, 0/5 Vdc, 50
Ω
Parameter
Insertion Loss
6
Rev. V3
Test Conditions
DC - 1.0 GHz
DC - 2.0 GHz
DC - 4.0 GHz
DC - 6.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 4.0 GHz
DC - 6.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 4.0 GHz
DC - 6.0 GHz
0.5 - 6.0 GHz, 0 / -5V, 0 / -8V
0.05 GHz, 0 / -5V, 0 / -8V
Two Tone Input Power up to +5 dBm
0.5 - 6.0 GHz
0.05 GHz
Two Tone Input Power up to +5 dBm
0.5 - 6.0 GHz
0.05 GHz
V
IN
Low (0 to –0.2 V)
V
OUT
High (-5 V @ 10 µA Typ to –8 V)
10% to 90% RF and 90% to 10% RF
50% control to 90% RF, and 50% control to 10% RF
In Band
Units
dB
dB
dB
dB
dB
dB
dB
dB
Ratio
Ratio
Ratio
Ratio
dBm
dBm
dBm
dBm
dBm
dBm
µA
µA
nS
nS
mV
Min.
—
—
—
—
40
35
25
20
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
+27 / +33
+21 / +26
+68
+62
+45
+40
—
—
2
4
15
Max.
0.6
0.8
1.0
1.5
—
—
—
—
1.2:1
1.4:1
1.5:1
1.8:1
—
—
—
—
—
—
5
100
—
—
—
Isolation
VSWR
Input P-1dB
IP2
IP3
Control Current
T-rise, T-fall
T
ON
, T
OFF
Transients
6. Loss changes 0.0025 dB/°C (-55°C to +85°C.)
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW6030G
GaAs DPDT Switch
DC - 6.0 GHz
Typical Performance
Insertion Loss
2.0
Insertion Loss +30°C
Insertion Loss -55°C
Insertion Loss +85°C
Rev. V3
Handling Precautions
Permanent damage to the MASW6030G may
occur if the following precautions are not adhered
to:
A. Cleaniness - MASW6030G should be handled
in a clean environment. DO NOT attempt to
clean unit after the MASW6030G is installed.
B. Static Sensitivity—All chip handling equipment
and personnel should be DC grounded.
C. Transient - Avoid instrument and power supply
transients while bias is applied to the
MASW6030G. Use shielded signal and bias
cables to minimize inductive pick-up.
D. Bias - Apply voltage to either of the
complementary control ports only when the
other is grounded. No port should be allowed to
“float”.
E.
General Handling - It is recommended that the
MASW6030G chip be handled along the long
side of the die with a sharp pair of bent
tweezers. DO NOT touch the surface of the
chip with fingers or tweezers.
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
Frequency (GHz)
VSWR @ 25°C
2.0
1.8
1.6
Wire Bonding
1.4
1.2
1.0
0
1
2
3
4
5
6
7
Frequency (GHz)
Isolation @ 25°C
80
A. Ball or wedge with 1.0 mil diameter pure gold
wire. Thermosonic wirebonding with a nominal
stage temperature of 150°C and a ball bonding
force of 40 to 50 grams or wedge bonding force
o1 18 to 22 grams is recommended. Ultrasonic
energy and time should be adjusted to the
minimum levels achieve reliable wirebonds.
B. Wirebonds should be started on the chip and
terminated on the package.
70
60
50
40
30
20
0
1
2
3
4
5
6
7
Frequency (GHz)
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW6030G
GaAs DPDT Switch
DC - 6.0 GHz
Mounting
The MASW6030G is back-metallized with Pd/Ni/Au
(100/1,000, 10,000 Å) metallization. It can be die-
mounted with AuSn eutectic preforms or with
thermally conductive epoxy. The package surface
should be clean and flat before attachment.
Eutectic Die Attach:
A. A 80/20 gold/tin preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
not 90/10 nitrogen/hydrogen gas is applied,
tool tip temperature should be approximately
290°C.
B. DO NOT expose the MASW6030G to a
temperature greater than 320°C for more than
20 seconds. No more than 3 seconds for
scrubbing should be required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place
the MASW6030G into position. A thin epoxy
fillet should be visible around the perimeter of
the chip.
B. Cure epoxy per manufacturer’s recommended
schedule.
C. Electrically conductive epoxy may be used by
is not required.
Rev. V3
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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