MCC
TM
Micro Commercial Components
omponents
20736 Marilla
Street Chatsworth
!"#
$
% !"#
1N5338B
THRU
1N5369B
Features
•
•
Zener Voltage From 5.1V to 51V
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
For Available Tolerances—See Note 1
Marking : Cathode band and type number
5 Watt
Zener Diode
5.1
to
51
Volts
DO-15
Maximum Ratings:
Operating Temperature: -55 C to +150 C
Storage Temperature: -55 C to +150 C
5 Watt DC Power Dissipation
Maximum Forward Voltage @ 1A: 1.2 Volts
Power Derating: 40 mW/ Above 75
Mechanical Characteristics
Case: JEDEC DO-15.
Terminals: Solder plated , solderable per MIL-STD-750,
Method 2026.
Standard Packaging: 52mm tape
D
A
Cathode
Mark
B
D
C
DIMENSIONS
INCHES
MIN
.230
.104
.026
1.000
MM
MIN
5.80
2.60
.70
25.40
DIM
A
B
C
D
MAX
.300
.140
.034
---
MAX
7.60
3.60
.90
---
NOTE
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MCC
1N5338B THRU 1N5369B
ELECTRICAL CHARACTERISTICS (T
A
=25
C
unless otherwise noted, V
F
=1.2 Max @ I
F
=1A for all types).
TM
Micro Commercial Components
MCC PART
NUMBER
REGULATOR
VOLTAGE
V
Z
(Note2)
TEST
CURRENT
I
ZT
MAXIMUM
DYNAMIC
IMPEDANCE
Z
Z
k
(@I
ZT
)
(Note2)
MAXIMUM
REVERSE
CURRENT
I
R
TEST
VOLTAGE
V
R
MAXIMUM
REGULATOR
CURRENT
I
ZM
(Note5)
MAXIMUM
DYNAMIC
KNEE
IMPEDANCE
ZZK@ 1.0mA
(Note2)
MAXIMUM
SURGE
CURRENT
I
r
(Note3)
MAXIMUM
VOLTAGE
REGULATION
(Note4)
VOLTS
1N5338B
1N5339B
1N5340B
1N5341B
1N5342B
1N5343B
1N5344B
1N5345B
1N5346B
1N5347B
1N5348B
1N5349B
1N5350B
1N5351B
1N5352B
1N5353B
1N5354B
1N5355B
1N5356B
1N5357B
1N5358B
1N5359B
1N5360B
1N5361B
1N5362B
1N5363B
1N5364B
1N5365B
1N5366B
1N5367B
1N5368B
1N5369B
5.1
5.6
6.0
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
14
15
16
17
18
19
20
22
24
25
27
28
30
33
36
39
43
47
51
mA
240
220
200
200
175
175
150
150
150
125
125
100
100
100
75
75
70
65
65
65
50
50
50
50
50
40
40
30
30
30
25
25
OHMS
1.5
1.0
1.0
1.0
1.0
1.5
1.5
2.0
2.0
2.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
3.0
3.0
3.5
3.5
4.0
5.0
6.0
8.0
10
11
14
20
25
27
1.0
1.0
1.0
1.0
10
10
10
10
7.5
5.0
5.0
2.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
A
VOLTS
1.0
2.0
3.0
3.0
5.2
5.7
6.2
6.6
6.9
7.6
8.4
9.1
9.9
10.6
11.5
12.2
12.9
13.7
14.4
15.2
16.7
18.2
19
20.6
21.2
22.8
25.1
27.4
29.7
32.7
35.8
38.8
mA
930
865
790
765
700
630
580
545
520
475
430
395
365
340
315
295
280
264
250
237
216
198
190
176
170
158
144
132
122
110
100
93
ohms
400
400
300
200
200
200
200
200
150
125
125
125
100
75
75
75
75
75
75
75
75
100
110
120
130
140
150
160
170
190
210
230
A
14.4
13.4
12.7
12.4
11.5
10.7
10
9.5
9.2
8.6
8.0
7.5
7.0
6.7
6.3
6.0
5.8
5.5
5.3
5.1
4.7
4.4
4.3
4.1
3.9
3.7
3.5
3.3
3.1
2.8
2.7
2.5
VOLTS
0.39
0.25
0.19
0.10
0.15
0.15
0.20
0.20
0.22
0.22
0.25
0.25
0.25
0.25
0.25
0.30
0.35
0.40
.040
.040
0.45
0.55
0.55
0.60
0.60
0.60
0.60
0.65
0.65
0.70
0.80
0.90
NOTE:
1. TOLERANCE AND VOLTAGE DESIGNATION - The JEDEC type numbers shown indicate a tolerance of+/-10% with
guaranteed limits on only Vz, I
R
, I
r
, and V
F
as shown in the electrical characteristics table. Units with guaranteed limits
on all seven parameters are indicated by suffix “B” for+/-5% tolerance.
2. ZENER VOLTAGE (Vz) AND IMPEDANCE (Z
ZT
& Z
ZK
) - Test conditions for Zener voltage and impedance are as
follows; Iz is applied 40+/-10 ms prior to reading. Mounting contacts are located from the inside edge of mounting
clips to the body of the diode(Ta=25
C
)
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MCC
TM
1N5338B THRU 1N5369B
Micro Commercial Components
3. SURGE CURRENT (Ir) - Surge current is specified as the maximum allowable peak, non-recurrent square-wave
current with a pulse width, PW, of 8.3 ms. The data given in Figure 5 may be used to find the maximum surge
current for a quare wave of any pulse width between 1 ms and 1000ms by plotting the applicable points on
logarithmic paper. Examples of this, using the 6.8v and 200V zeners, are shown in Figure 6. Mounting
contact located as specified in Note 3. (T
A
=25
).
4. VOLTAGE REGULATION (Vz) - Test conditions for voltage regulation are as follows: Vz measurements are made
at 10% and then at 50% of the Iz max value listed in the electrical characteristics table. The test currents are the
same for the 5% and 10% tolerance devices. The test current time druation for each Vz measurement is 40+/- 10 ms.
(T
A
=25C ). Mounting contact located as specified in Note2.
5. MAXIMUM REGULATOR CURRENT (I
ZM
) - The maximum current shown is based on the maximum voltage of a
5% type unit. Therefore, it applies only to the B-suffix device. The actual I
ZM
for any device may not exceed the
value of 5 watts divided by the actual Vz of the device. T
L
=75Cat maximum from the device body.
APPLICATION NOTE:
Since the actual voltage available from a given zener
diode is temperature dependent, it is necessary to
determine junction temperature under any set of
operating conditions in order to calculate its value. The
following procedure is recommended:
Lead Temperature, T
L
, should be determined from:
T
L
=th
LA
P
D
+ T
A
th
LA
of P
D
and the extremes of T
J(
T
J
) may be estimated.
Changes in voltage, Vz, can then be found from:
, the zener voltage temperature coefficient, is fount
from Figures 2.
Under high power-pulse operation, the zener voltage will
vary with time and may also be affected significantly be
the zener resistance. For best regulation, keep current
excursions as low as possible.
Data of Figure 3 should not be used to compute surge
capability. Surge limitations are given in Figure 5. They
are lower than would be expected by considering only
junction temperature, as current crowding effects cause
temperatures to be extremely high in small spots resulting
in device degradation should the limits of Figure. 5 be
exceeded.
is the lead-to-ambient thermal resistance ( /W)
and P
D
is the power dissipation.
Junction Temperature, T
J
, may be found from:
T
J
= T
L
+ T
JL
T
JL
is the increase in junction temperature above the
lead temperature and may be found from Figure 3 for a
train of power pulses or from Figure 4 for dc power.
T
JL
=
JL
P
D
For worst-case design, using expected limits of Iz, limits
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MCC
RATING AND CHARACTERISTICS CURVES
1N5338B THRU 1N5369B
PD, MAXIUMU POWER DISSIPATION (WATTS)
TM
Micro Commercial Components
TEMPERATURE COEFFICIENTS
VZ, TEMPERATURE
COEFFICIENT (mA/_@IZT
300
200
100
50
30
20
10
5
0
20 40 60
80 100 120 140 160 180 200 220
RANGE
8
6
4
2
0
0
20
40
60
80
100
120
L = LEAD LENGTH TO
HEAT SINK
(SEE FIGURE 5)
VZ, ZENER VOLTAGE @IZT (VOLTS)
TL, LEAD TEMPERATURE
Fig. 1-POWER TEMPERATURE DERATING CURVE
Fig. 2-TEMPERATURE COEFFICIENT-RANGE FOR UNITS
6 TO 51 VOLTS
JL(t,D), TRANSIENT THERMAL
RESISTANCE JUNCTION-TO-
LEAD(/W)
30
20
10
7
5
3
2
1
0.7
0.5
0.05
0.02
NOTE BELOW 0.1 SECOND,
THERMAL RESPONSE
CURVE IS APPLICABLE TO
ANY LEAD LENGTH (L)
0.002
0.005
0.01
0.02
0.05
DUTY CYCLE, D = t1 / t2
SINGLE PULSE TJL = JL(t)PPK
REPETITIVE PULSES TJL =
JL(t,D)PPK
0.1
0.2
0.5
1
2
5
10
D = 0.5
0.2
0.1
0.01
0.3
0.0001 0.0002
D=0
0.0005
0.001
TIME (SECONDS)
Fig. 3-TYPICAL THERMAL RESPONSE
JL, JUNCTION-TO -LEAD THERMAL
RESISTANCE (C/W)
IR, PEAK SURGE CURRENT (AMPS)
40
20
10
4
2
1
PW = 1000ms*
0.4
0.2
0.1
3
SINE / SQUARE WAVE PW = 100ms*
4
6
8 10
20
30 40
60 80 100
200
PW = 1ms*
PW = 8.3ms*
40
30
20
10
0
MOUNT ON 8.0mm
COPPER PADS TO
EACH TERMINAL
2
0
0.2
0.4
0.6
0.8
1
L, LEAD LENGTH TO HEAT SINK (INCH)
NOMINAL VZ(V)
Fig. 4-TYPICAL THERMAL RESISTANCE
Fig. 5-MAXIMUM NON-REPETITIVE SURGE
CURRENT VERSUS NOMINAL ZENER
VOLTAGE (SEE NOTE 3)
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MCC
RATING AND CHARACTERISTICS CURVES
1N5338B THRU 1N5369B
ZENER VOLTAGE VERSUS ZENER CURRENT
(FIGURES 7,8)
30
20
10
5
2
1
0.5
0.2
0.1
1
10
100
1000
PLOTTED FROM INFORMATION
GIVEN IN FIGURE 6
TM
Micro Commercial Components
IZ, ZENER CURRENT (mA)
VZ = 6.8V
T
C
= 25
1000
100
10
1
0.1
T = 25
1
2
3
4
5
6
7
8
9
10
VZ, ZENER VOLTAGE (VOLTS)
Fig. 6-PEAK SURGE CURRENT VERSUS PULSE
WIDTH(SEE NOTE 3)
1000
Fig. 7-ZENER VOLTAGE VERSUS ZENER CURRENT
VZ = 6.8 THRU 10 VOLTS
IZ, ZENER CURRENT (mA)
T = 25
100
10
1
0.1
10
20
30
40
50
60
70
80
VZ, ZENER VOLTAGE (VOLTS)
Fig. 8-ZENER VOLTAGE VERSUS ZENER CURRENT
VZ = 11 THRU 51 VOLTS
*** Data of Figure 3 should not be used to compute surge capability. Surge limitations are given in Figure 5. They are
lower than would be expected by considering only junction temperature, as current crowding effects cause
temperatures to be extremely high in small spots resulting in device degradation should the limits of Figure. 5 be
exceeded
Revision: 4
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5 of 6
2006/06/09
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