SOIC-16, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | DC16 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.6 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 74LVC257ADC | 74LVC257APG | 74LVC257APY | 74LVC257AQ | |
|---|---|---|---|---|
| 描述 | SOIC-16, Tube | TSSOP-16, Tube | SSOP-16, Tube | QSOP-16, Tube |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | TSSOP | SSOP | QSOP |
| 针数 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | DC16 | PG16 | PY16 | PC16 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 功能数量 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SSOP | SSOP |
| 封装等效代码 | SOP16,.25 | TSSOP16,.25 | SSOP16,.3 | SSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.6 ns | 4.6 ns | 4.6 ns | 4.6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 | - |
| 湿度敏感等级 | 1 | 1 | - | 1 |
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