RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP80,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Cypress(赛普拉斯) |
Reach Compliance Code | compliant |
位大小 | 32 |
CPU系列 | CORTEX-M4F |
JESD-30 代码 | S-PQFP-G80 |
端子数量 | 80 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP80,.63SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 65536 |
ROM(单词) | 139264 |
ROM可编程性 | FLASH |
速度 | 160 MHz |
最大压摆率 | 126 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
MB9BF166MPMC1 | MB9BF166MPMC | MB9BF166NBGL | MB9BF166NPMC | MB9BF166NPQC | MB9BF166RBGL | MB9BF166RPMC | |
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描述 | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP80, | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP80, | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP100, | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP100, | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PBGA144 | RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 160MHz, CMOS, PQFP120, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
CPU系列 | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F |
端子数量 | 80 | 80 | 112 | 100 | 100 | 144 | 120 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装等效代码 | QFP80,.63SQ | QFP80,.55SQ,20 | BGA112,13X13,20 | QFP100,.63SQ,20 | QFP100,.7X.9 | BGA144,13X13,20 | QFP120,.7SQ,20 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 |
ROM(单词) | 139264 | 139264 | 139264 | 139264 | 139264 | 139264 | 139264 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
速度 | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz |
最大压摆率 | 126 mA | 126 mA | 126 mA | 126 mA | 126 mA | 126 mA | 126 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
JESD-30 代码 | S-PQFP-G80 | S-PQFP-G80 | - | S-PQFP-G100 | R-PQFP-G100 | S-PBGA-B144 | S-PQFP-G120 |
封装代码 | QFP | LFQFP | - | LFQFP | QFP | FBGA | LFQFP |
封装形状 | SQUARE | SQUARE | - | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | GRID ARRAY, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
端子形式 | GULL WING | GULLWING | - | GULLWING | GULL WING | BALL | GULLWING |
端子节距 | 0.635 mm | 0.5 mm | - | 0.5 mm | 0.635 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | - | QUAD | QUAD | BOTTOM | QUAD |
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