电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1206GC151KAZ3A

产品描述Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00015uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小52KB,共2页
制造商AVX
标准  
下载文档 详细参数 全文预览

1206GC151KAZ3A概述

Ceramic Capacitor, Multilayer, Ceramic, 2000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00015uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

1206GC151KAZ3A规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称AVX
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.00015 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.52 mm
JESD-609代码e3
长度3.2 mm
制造商序列号1206
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, 13 INCH
正容差10%
额定(直流)电压(URdc)2000 V
系列SIZE(FLEXITERM)HV
尺寸代码1206
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度1.6 mm

文档预览

下载PDF文档
High Voltage MLC Chips FLEXITERM
®
For 600V to 3000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally
encountered are necessary. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assemblies.
In response to this, and to follow from the success of the FLEXITERM
®
range of low voltage parts, AVX is delighted to offer a FLEXITERM
®
high
voltage range of capacitors, FLEXITERM
®
.
The FLEXITERM
®
layer is designed to enhance the mechanical flexure
and temperature cycling performance of a standard ceramic capacitor,
giving customers a solution where board flexure or temperature cycle
damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
C
A
S
G
W
H
C
272
K
A
Test Level
Z
Termination*
Z = FLEXITERM
®
100% Tin
(RoHS Compliant)
1
A
Temperature Capacitance Code Capacitance
Coefficient
(2 significant digits
Tolerance
C0G = A
+ no. of zeros)
C0G: J = ±5%
X7R = C
Examples:
K = ±10%
10 pF = 100
M = ±20%
100 pF = 101 X7R: K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
0805
1206
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1210*
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
1808*
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1812*
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1825*
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.30
(0.252 ± 0.012)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
2.01 ± 0.20
(0.079 ± 0.008)
(W) Width
1.25 ± 0.20
(0.049 ± 0.008)
(T) Thickness
1.30
Max.
(0.051)
(t) terminal min. 0.50 ± 0.25
max. (0.020 ± 0.010)
*Reflow Soldering Only
millimeters (inches)
2220*
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
2225*
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
91
请问无线wifi充电器的工作原理哪位同仁能够提供 一下?
请问无线wifi充电器的工作原理哪位同仁能够提供 一下? ...
伍玉斌 无线连接
什么是eXpressDSP
eXpressDSP是一种实时DSP软件技术,它是一种DSP编程的标准,利用它可以加快你开发DSP软件的速度。 以往DSP软件的开发没有任何标准,不同的人写的程序一般无法连接在一起。DSP软件的调试工具也非 ......
Jacktang DSP 与 ARM 处理器
wince 5.0 OS开发, 谢谢有经验的推荐一款开发板
最好介绍一下推荐理由...
chenseawind 嵌入式系统
安卓蓝牙BLE接收大量数据的问题
最近在做一个可穿戴设备,下位机用蓝牙模块,上位机用安卓,下位机需要以5kB/s的速率传输,上位机总是接收几包就连接断了,用抓包器看了一下,下位机传输速度很多,每个连接间隔45ms,但是需要 ......
flashtt Linux开发
印刷电子当选2010年影响世界的十大潜力新技术
2. 印刷电子 能快速印刷出多个导体/绝缘体或半导体层以形成电路的技术,可望催生比目前采用传统制程生产之IC成本更低芯片。通常印刷半导体意味着使用性能与硅大不相同 的有机材料,甚至所 ......
zero3360 PCB设计
编译交叉工具时遇到的问题
我想在cygwin下编译基于目标cpu i960的交叉编译工具链 在编译bootrap gcc的时候遇到一个libgcc1.a的问题 mv libgcc1.a libgcc1.cross || (echo You must find a way to make libgcc1.a; fal ......
xuexithree 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2540  2692  594  1270  2086  2  27  21  17  40 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved