The documentation and process conversion measures
necessary to comply with this document shall be
completed by 24 September 2013.
INCH-POUND
MIL-PRF-19500/578M
24 June 2013
SUPERSEDING
MIL-PRF-19500/578L
19 October 2010
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, 1N6638, 1N6642, 1N6643,
1N6638U, 1N6642U, 1N6643U, 1N6638US, 1N6642US, 1N6643US, 1N6642UB, 1N6642UB2,
1N6642UB2R, 1N6642UBCA, 1N6642UBD, 1N6642UBCC, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
The JANS1N4148-1 is no longer qualified and is superseded by JANS1N6642. See
6.4.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for switching diodes. Four levels of product
assurance are provided for each device type as specified in MIL-PRF-19500.
* 1.2 Physical dimensions. See figures 1 (DO-35), 2 (U, US), 3 (UB), 4 (UB2), 5, and 6.
1.3 Maximum ratings. Unless otherwise specified T
A
= +25°C.
VBR
Types
VRWM IO(PCB)
TA=75
°
(1) (2)
V (pk) V (pk)
1N6638
1N6638U, 1N6638US
1N6642
1N6642U, 1N6642US
1N6642UB, 1N6642UB2,
1N6642UB2R, 1N6642UBCA,
1N6642UBD, 1N6642UBCC
1N6643
1N6643U, 1N6643US
150
150
100
100
100
75
75
125
125
75
75
75
50
50
mA
300
300
300
300
300
300
300
IFSM
tp =
1/120 s
RθJL
L=
.375 inch
(9.53 mm)
(1) (2)
RθJEC
L=0
(1)
RθJA(PCB)
(2)
RθJSP
(1) (3)
TSTG
& TJ
A (pk)
2.5
2.5
2.5
2.5
2.5
2.5
2.5
°
C/W
150
°
C/W
40
°
C/W
250
250
250
250
325
°
C/W
°
C
-65 to +175
-65 to +175
-65 to +175
-65 to +175
150
40
100
-65 to +200
-65 to +175
-65 to +175
150
40
250
250
* (1)
* (2)
(3)
For temperature-current derating curves, see figures 7 and 8.
See figures 9, 10, 11, and 13 for thermal impedance curves. T
A
= +75°C for both axial and Metal Electrode
Leadless Face diodes (MELF) (U, US) on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm)
1-layer 1-Oz Cu, horizontal, in still air; pads for U, US = .061 inch (1.55 mm) x .105 inch (2.67 mm); pads for axial
= .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ .187 inch
(≤ 4.75 mm); RθJA with a defined PCB thermal resistance condition included, is measured at IO = 300 mA dc.
RθJSP refers to thermal resistance from junction to the solder pads of the UB package.
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@.dla.mil.
Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at
https://assist.dla.mil
.
AMSC N/A
FSC 5961
MIL-PRF-19500/578M
1.4 Primary electrical characteristics. Unless otherwise specified, primary electrical characteristics at T
A
= +25°C.
V
F1
IF =
10 mA
VF2
IR1
VR =
20 V
IR2
VR =
VRWM
IR3
VR = 20 V
TA =
+150
°
C
V dc
1N6638, 1N6638U, 1N6638US
1N6642, 1N6642U, 1N6642US,
1N6642UB, 1N6642UB2,
1N6642UBCA, 1N6642UB2R,
1N6642UBD, 1N6642UBCC
1N6643, 1N6643U, 1N6643US
0.8
0.8
0.8
V dc
1.1 (2)
1.2 (3)
1.2 (3)
nA dc
35
25
50
nA dc
500
500
500
µA
dc
50
50
75
IR4
VR =
VRWM
TA =
+150
°
C
µA
dc
100
100
100
ns
20
20
20
ns
4.5
5.0
6.0
pF
2.5
5.0
5.0
t
fr
I
F
=
200mA
trr
IRM = IF =
10 mA
CT1
VR = 0
Types (1)
(1) Suffix "U" devices are structurally identical to the suffix "US" devices.
(2) IF = 200 mA.
(3) IF = 100 mA.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500 -
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or
https://assist.dla.mil
or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
2
MIL-PRF-19500/578M
Symbol
BD
BL
LD
LL
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.056
.130
.018
1.00
.080
.180
.022
1.50
1.42
3.30
0.46
25.40
2.03
4.57
0.56
38.10
Notes
2
3
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Dimension BD shall be measured at the largest diameter.
3. The specified lead diameter applies in the zone between .050 inch (1.27 mm) from the diode body to the
end of the lead. Outside of this zone lead shall not exceed BD.
4. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
TYPES 1N6638, 1N6642, AND 1N6643.
FIGURE 1. Physical dimensions (DO-35).
3
MIL-PRF-19500/578M
US
Dimensions
Symbol
Min
BD
BL
ECT
S
.070
.165
.019
.003
Inches
Max
.085
.195
.028
Millimeters
Min
1.78
4.19
0.48
0.08
Max
2.16
4.95
0.71
NOTES:
1.
2.
3.
4.
Dimensions are in inches. Millimeters are given for general information only.
Dimensions are pre-solder dip.
U-suffix parts are structurally identical to the US-suffix parts.
In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
TYPES 1N6638U, 1N6642U, AND 1N6643U, 1N6638US, 1N6642US, AND 1N6643US
FIGURE 2. Physical dimensions of surface mount family.
4
MIL-PRF-19500/578M
UB
1N6642UBCA
1N6642UB
2
1N6642UBD
1
1N6642UBCC
Symbol
BH
BL
BW
CL
CW
LL1
LL2
NOTES:
1.
2.
3.
4.
5.
Dimensions
Inches
Millimeters
Max
Min
Min
Max
.046
.056
1.17
1.42
.115
.128
2.92
3.25
.085
.108
2.16
2.74
.128
3.25
.108
2.74
.022
.038
0.56
0.97
.017
.035
0.43
0.89
Symbol
LS1
LS2
LW
r
r1
r2
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.035
.039
0.89
0.99
.071
.079
1.80
2.01
.016
.024
0.41
0.61
.008
0.20
.012
0.31
.022
0.56
Dimensions are in inches. Millimeters are given for general information only.
Ceramic package only.
Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid.
Dimensions are pre-solder dip.
In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
FIGURE 3. Physical dimensions, surface mount (UB version).
5
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