Flash PLD, 10ns, CMOS, PQFP208, HQFP-208
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | XILINX(赛灵思) |
| 零件包装代码 | QFP |
| 包装说明 | FQFP, |
| 针数 | 208 |
| Reach Compliance Code | compliant |
| 其他特性 | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
| 最大时钟频率 | 66.7 MHz |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e3 |
| 长度 | 28 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | |
| I/O 线路数量 | 166 |
| 端子数量 | 208 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 0 DEDICATED INPUTS, 166 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 28 mm |
| XC95216-10HQG208I | XC95216-10PQG160C | XC95216-20PQG160C | XC95216-15PQG160C | XC95216-15BG352I | XC95216-15HQG208I | XC95216-20HQG208C | XC95216-20HQG208I | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash PLD, 10ns, CMOS, PQFP208, HQFP-208 | IC cpld 216mc 10ns 160pqfp | IC cpld 216mc 20ns 160pqfp | IC cpld 216mc 15ns 160pqfp | IC cpld 216mc 15ns 352bga | Flash PLD, 15ns, CMOS, PQFP208, HQFP-208 | Flash PLD, 20ns, CMOS, PQFP208, HQFP-208 | Flash PLD, 20ns, CMOS, PQFP208, HQFP-208 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
| 零件包装代码 | QFP | QFP | QFP | QFP | BGA | QFP | QFP | QFP |
| 包装说明 | FQFP, | LEAD FREE, PLASTIC, QFP-160 | LEAD FREE, PLASTIC, QFP-160 | LEAD FREE, PLASTIC, QFP-160 | BGA-352 | FQFP, | FQFP, | FQFP, |
| 针数 | 208 | 160 | 160 | 160 | 352 | 208 | 208 | 208 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | not_compliant | compliant | compliant | compliant |
| 最大时钟频率 | 66.7 MHz | 66.7 MHz | 50 MHz | 55.6 MHz | 55.6 MHz | 55.6 MHz | 50 MHz | 50 MHz |
| JESD-30 代码 | S-PQFP-G208 | S-PQFP-G160 | S-PQFP-G160 | S-PQFP-G160 | S-PBGA-B352 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e0 | e3 | e3 | e3 |
| 长度 | 28 mm | 28 mm | 28 mm | 28 mm | 35 mm | 28 mm | 28 mm | 28 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 166 | 133 | 133 | 133 | 166 | 166 | 166 | 166 |
| 端子数量 | 208 | 160 | 160 | 160 | 352 | 208 | 208 | 208 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 0 DEDICATED INPUTS, 166 I/O | 0 DEDICATED INPUTS, 133 I/O | 0 DEDICATED INPUTS, 133 I/O | 0 DEDICATED INPUTS, 133 I/O | 0 DEDICATED INPUTS, 166 I/O | 0 DEDICATED INPUTS, 166 I/O | 0 DEDICATED INPUTS, 166 I/O | 0 DEDICATED INPUTS, 166 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | QFP | QFP | QFP | LBGA | FQFP | FQFP | FQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | FLATPACK | FLATPACK | FLATPACK | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | 225 | 245 | 245 | 245 |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 10 ns | 10 ns | 20 ns | 15 ns | 15 ns | 15 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.1 mm | 3.7 mm | 3.7 mm | 3.7 mm | 1.4 mm | 4.1 mm | 4.1 mm | 4.1 mm |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn63Pb37) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.4 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | BOTTOM | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 28 mm | 28 mm | 28 mm | 28 mm | 35 mm | 28 mm | 28 mm | 28 mm |
| 其他特性 | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | YES | YES | YES | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | - | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
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