TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistors
FEATURES
• Low temperature coefficient and tight
tolerances (± 0.1 %; ± 10 ppm/K)
• Superior moisture resistivity
0.25 % (85 °C;
56 days; 85 % RH)
• Excellent overall stability at different
environmental conditions
0.05 % (1000 h
rated power at 70 °C)
• AEC-Q200 qualified (sizes 0402 to 1206)
• Waste gas resistant
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
TNPW e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where highest
reliability and stability is of major concern. Typical
applications include test and measuring equipment, medical
equipment, industrial, and automotive.
APPLICATIONS
•
•
•
•
Test and measuring equipment
Medical equipment
Industrial equipment
Automotive
STANDARD ELECTRICAL SPECIFICATIONS
DESCRIPTION
Metric size
Resistance range
Resistance tolerance
Temperature
coefficent
Rated dissipation,
P
70 (2)
Operating voltage,
U
max.
AC/DC
Permissible film
temperature,
F
max.
Operating
temperature range
Thermal resistance
(3)
Max. resistance
change at
P
70
;
R/R:
1000 h
8000 h
225 000 h
Insulation voltage:
U
ins
1 min
Continuous
Failure rate:
FIT
observed
75 V
75 V
0.1
x 10
-9
/h
100 V
75 V
0.1
x 10
-9
/h
200 V
75 V
0.1
x 10
-9
/h
300 V
75 V
0.1
x 10
-9
/h
300 V
75 V
0.1
x 10
-9
/h
300 V
75 V
0.1
x 10
-9
/h
300 V
75 V
0.1
x 10
-9
/h
870 K/W
550 K/W
440 K/W
0.063 W
50 V
TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3
(1)
TNPW2010 e3 TNPW2512 e3
(1)
RR 1005M
RR 1608M
RR 2012M
RR 3216M
RR 3225M
RR 5025M
RR 6332M
10
to 100 k 10
to 332 k 10
to 1 M
10
to 2 M 10
to 3.01 M 10
to 4.99 M 10
to 8.87 M
± 1 %; ± 0.5 %; ± 0.1 %
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
0.1 W
75 V
0.125 W
150 V
0.25 W
200 V
155 °C
- 55 °C to 125 °C (155 °C)
220 K/W
170 K/W
140 K/W
110 K/W
0.33 W
200 V
± 50 ppm/K; ± 25 ppm/K
0.4 W
300 V
0.5 W
300 V
10
to 100 k 10
to 332 k 10
to 1 M
0.05
%
0.10
%
0.30
%
0.05
%
0.10
%
0.30
%
0.05
%
0.10
%
0.30
%
10
to 2 M 10
to 3.01 M 10
to 4.99 M 10
to 8.87 M
0.05
%
0.10
%
0.30
%
0.05
%
0.10
%
0.30
%
0.05
%
0.10
%
0.30
%
0.05
%
0.10
%
0.30
%
Notes
• TNPW 0402 without marking.
(1)
Size not specified in EN 140401-801.
(2)
Rated voltage
P
x
R
. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). Using advanced temperature level may require special considerations towards
the choice of circuit board and solder material. The rated dissipation applies only if the permitted film temperature is not exceeded.
(3)
Measuring conditions in accordance with EN 140401-801.
Document Number: 28758
www.vishay.com
For technical questions, contact:
thinfilmchip@vishay.com
336
Revision: 27-Jun-12
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
PACKAGING
TYPE
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
CODE
ET7 = ED
E52 = EN
ET1 = EA
ET6 = EC
E75 = EY
E75 = EY
TNPW2512 e3
E67 = EG
2000
QUANTITY
10 000
1000
(1)
5000
20 000
1000
1000
Blister tape
acc. IEC 60286-3
Type II
12 mm
4 mm
180 mm / 7"
Paper tape
acc. IEC 60286-3
Type I
CARRIER TAPE
WIDTH
PITCH
2 mm
REEL DIAMETER
180 mm / 7"
8 mm
4 mm
180 mm / 7"
4 mm
330 mm / 13"
Note
(1)
1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient
± 25 ppm/K.
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI
2
O
3
ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. This includes pulse load screening for the
elimination of products with a potential risk of early life
failures according to EN 140401-801, 2.1.2.2. Only accepted
products are laid directly into the tape in accordance with
EN 60286-3.
All products comply with the
GADSL
(2)
and the
CEFIC-EECA-EICTA
(3)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
The resistors are Halogen-free according to JEDEC JS709A
definition.
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for
those applications, where lead bearing terminations are
mandatory. For ordering TNPW with SnPb terminations
please refer to latest edition of data sheet TNPW, document
number 31006.
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment,
where matured technology and proven reliability are of
utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems. Approval of the
TNPS .... ESCC products is granted by the European Space
Components Coordination and registered in the ESCC
Qualified Parts List, REP005, document number 28789.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1.
The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system. The resistors are RoHS compliant, the pure
tin plating provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
Notes
(2)
Global Automotive Declarable Substance List, see
www.gadsl.org.
(3)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see
www.eicta.org
issue
environment policy
chemicals
chemicals for electronics.
www.vishay.com
Document Number: 28758
For technical questions, contact:
thinfilmchip@vishay.com
Revision: 27-Jun-12
339
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Microchip MCU
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