CYStech Electronics Corp.
5.0Amp Schottky Barrier Rectifiers
Reverse Voltage 20V to 60V
Forward Current 5A
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 1/3
SB520 thru SB560
Features
•
Guard ring for over voltage protection.
•
Plastic package has UL flammability classification 94V-0
•
Low power loss, high efficiency
•
For use in low voltage, high frequency inverters, free wheeling,
and polarity protection applications
Outline
DO-201AD
Mechanical Data
•
Case : JEDEC DO-201AD molded plastic body
•
Epoxy : UL94V-0 rate flame retardant
•
Terminals: Plated axial leads, solderable per MIL-STD-750 method
2026. High temperature soldering guaranteed: 250°C/10seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg)
tension
•
Polarity: Color band denotes cathode end.
•
Mounting Position : Any.
•
Weight: 0.041 oz., 1.15 gram
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
1
Maximum instantaneous forward voltage at 5A
Maximum average forward rectified current @
0.375”(9.5mm) lead length
(see Fig 1)
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method) at rated T
L
T
A
=25°C
Maximum DC reverse current at
1
rated DC blocking voltage
T
A
=100°C
Typical thermal resistance
2
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
R
θJA
R
θJL
T
J
T
STG
Type
Units
SB520 SB530 SB540 SB550 SB560
20
30
40
50
60
V
14
21
28
35
42
V
20
30
40
50
60
V
0.55
0.67
V
5
150
0.5
50
25
8
-55 ~ +125
-55 ~ +150
-55 ~ +150
25
A
A
mA
℃
/W
℃
℃
Operating junction temperature range
Storage temperature range
Note: 1.Pulse test: pulse width≤300μs, duty cycle≤1%
2.Thermal resistance, junction to lead, vertical PCB mounted, 0.375”(9.5mm) lead length
SB520 thru SB560
CYStek Product Specification
CYStech Electronics Corp.
DO-201AD Dimension
Spec. No. : C762LD
Issued Date : 2009.05.15
Revised Date :
Page No. : 3/3
DO-201AD Molded Plastic Package
CYStek Package Code: LD
DIM
A
B
C
Inches
Min.
Max.
ϕ0.048 ϕ0.052
1.000
-
0.285
0.375
Millimeters
Min.
Max.
ϕ1.20
ϕ1.30
25.40
-
7.20
9.50
DIM
D
E
Inches
Min.
Max.
1.000
-
ϕ0.190 ϕ0.210
Millimeters
Min.
Max.
25.40
-
ϕ4.80
ϕ5.30
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
•
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB520 thru SB560
CYStek Product Specification
嵌入式系统
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