EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
MSE PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= XXX°C,
θ
JA
= 35°C/W (Note 3)
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC4425EDD#PBF
LTC4425IDD#PBF
LTC4425EMSE#PBF
LTC4425IMSE#PBF
TAPE AND REEL
LTC4425EDD#TRPBF
LTC4425IDD#TRPBF
LTC4425EMSE#TRPBF
LTC4425IMSE#TRPBF
PART MARKING*
LFMQ
LFMQ
4425
4425
PACKAGE DESCRIPTION
12-Lead (3mm
×
3mm) Plastic DFN
12-Lead (3mm
×
3mm) Plastic DFN
12-Lead Plastic MSOP
12-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
4425p
2
LTC4425
ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
V
IN
I
Q(IN)
I
Q(OUT)
I
SD
V
FWD
R
FWD
The
l
denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at T
A
= T
J
= 25°C, V
IN
= 3.8V. (Note 4)
CONDITIONS
l
MIN
2.7
TYP
20
3
MAX
5.5
UNITS
V
μA
μA
Operating Supply Range
Quiescent Current from V
IN
Quiescent Current from V
OUT
Quiescent Current in Shutdown
Forward Voltage
Open Loop Forward On-Resistance
Feedback Voltage
Feedback Pin Input Leakage
Charge Current in LDO Mode
(FB = 0V)
Charge Current in Normal Mode (FB = V
IN
)
R
PROG
= 0.5k
R
PROG
= 5k
R
PROG
= 0.5k, V
IN
– V
OUT
< 250mV
R
PROG
= 0.5k, V
IN
– V
OUT
> 750mV
R
PROG
= 5k, V
IN
– V
OUT
< 250mV
R
PROG
= 5k, V
IN
– V
OUT
> 750mV
V
IN
= V
OUT
V
IN
= V
OUT
EN = 0
3
15
50
l
μA
mV
mΩ
Ideal Diode
Supercap Charger
V
FB
I
FB
I
CHG
1.18
1.2
100
2
0.2
2
0.2
200
20
1.00
1000
V
IN
– V
OUT
< 250mV
V
IN
– V
OUT
> 750mV
PROG Pin Shorted to GND, FB = 0
FB = 0
V
OUT
= 0, FB = 0, R
PROG
= 0.5k
2
1.00
0.1
3
1.5
105
4
1.22
V
nA
A
A
A
A
mA
mA
V
mA/mA
V
V
A
ms
°C
V
PROG
h
PROG
V
PROG
I
SC
t
SS
T
LIM
PROG Pin Servo Voltage in LDO Mode
Ratio of Charge Current to PROG Pin Current
PROG Pin Servo Voltage in Normal Mode (FB = V
IN
)
Charger Short-Circuit Current Limit
Charger Soft Start Time
Junction Temperature in Constant Temperature
Mode (Note 5)
Maximum Voltage Across the Top Capacitor
Maximum Voltage Across the Bottom Capacitor
FB < 1.2V
Voltage Clamps
V
CLAMP
V
SEL
= Lo
V
SEL
= Hi
V
SEL
= Lo
V
SEL
= Hi
If Either Capacitor Reaches Clamp
Voltage i.e. V
OUT
< V
IN
R
PROG
= 1k, (V
OUT
– V
MID
) > V
CLAMP
R
PROG
= 1k, V
MID
> V
CLAMP
l
l
l
l
2.45
2.7
2.45
2.7
50
160
140
2.5
2.75
2.5
2.75
V
V
V
V
mV
mA
mA
V
RIP
I
SH(TOP)
I
SH(BOT)
V
OUT
Clamp Hysteresis
Top Shunt Current
Bottom Shunt Current
4425p
3
LTC4425
ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
Leakage Balancer
V
MID
V
MID
Output Voltage
V
MID
Maximum Current Sourcing Capability
V
MID
Maximum Current Sinking Capability
PFO,
PFI_RET, PFI
Output Low Voltage (PFO, PFI_RET)
Pin Leakage Current (PFO, PFI_RET)
FB Threshold Voltage for Power Good (Rising)
V
PFI
I
PFI
PFI Threshold (Falling)
PFI Hysteresis
PFI Pin Input Leakage
Power Good Timer Delay
Logic Inputs (EN, SEL)
V
IL
V
IH
I
IH
I
IL
Logic Low Input Voltage
Logic High Input Voltage
Input Current High
Input Current Low
EN, SEL Pins at 5.5V
EN, SEL Pins at GND
l
l
l
l
The
l
denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at T
A
= T
J
= 25°C, V
IN
= 3.8V. (Note 4)
CONDITIONS
V
OUT
= 3.6V
V
MID
< V
OUT/2
, V
MID
< V
CLAMP
V
MID
> V
OUT/2
, V
MID
< V
CLAMP
I
PIN
= 5mA
V
PIN
= 5V, EN = 0
LDO Mode
l
l
MIN
1.76
TYP
1.8
0.7
1.2
65
MAX
1.84
UNITS
V
mA
mA
100
1
1.13
1.22
mV
μA
V
mV
V
mV
nA
ms
1.09
1.18
1.11
265
1.2
10
100
200
Input-to-Output Differential for Power Good (Rising) Normal Mode
0.4
1.2
–1
–1
1
1
V
V
μA
μA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The current limit features of this part are intended to protect the
IC from short term or intermittent fault conditions. Continuous operation
above the maximum specified pin current rating may result in device
degradation or failure.
Note 3:
Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much greater than
43°C/W on the DD package and greater than 35°C C/W on MSE package.
Note 4:
The LTC4425E (E grade) is guaranteed to meet specifications
from 0°C to 85°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC4425I (I grade) is guaranteed over the full –40°C to 125°C operating
junction temperature range. The junction temperature, T
J
, is calculated
from the ambient temperature, T
A
, and power dissipation, P
D
, according to
the formula:
T
J
= T
A
+ (P
D
•
θ
JA
°C/W).
Note that the maximum ambient temperature is determined by specific
operating conditions in conjunction with board layout, the rated thermal
package thermal resistance and other environmental factors.
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