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25LC512-I/MF: 产品描述64K X 8 SPI BUS SERIAL EEPROM, PDIP8; 产品类别存储存储; 文件大小621KB，共36页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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25LC512-I/MF概述

64K X 8 SPI BUS SERIAL EEPROM, PDIP8

64K × 8 总线串行电可擦除只读存储器, PDIP8

25LC512-I/MF规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	DFN
包装说明	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
Factory Lead Time	13 weeks
最大时钟频率 (fCLK)	20 MHz
数据保留时间-最小值	200
耐久性	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-N8
JESD-609代码	e3
长度	6 mm
内存密度	524288 bi
内存集成电路类型	EEPROM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	8
字数	65536 words
字数代码	64000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	64KX8
封装主体材料	PLASTIC/EPOXY
封装代码	HVSON
封装等效代码	SOLCC8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	2.5/5 V
认证状态	Not Qualified
座面最大高度	1 mm
串行总线类型	SPI
最大待机电流	0.000001 A
最大压摆率	0.01 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	5 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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25LC512

512 Kbit SPI Bus Serial EEPROM

Device Selection Table

Part Number

25LC512

Range

2.5-5.5V

Page Size

128 Byte

Temp. Ranges

I,E

Packages

P, SN, SM, MF

Features:

• 20 MHz max. Clock Speed

• Byte and Page-level Write Operations:

- 128-byte page

- 5 ms max.

- No page or sector erase required

• Low-Power CMOS Technology:

- Max. Write Current: 5 mA at 5.5V, 20 MHz

- Read Current: 10 mA at 5.5V, 20 MHz

- Standby Current: 1A at 2.5V (Deep power-

down)

• Electronic Signature for Device ID

• Self-Timed Erase and Write cycles:

- Page Erase (5 ms, typical)

- Sector Erase (10 ms/sector, typical)

- Bulk Erase (10 ms, typical)

• Sector Write Protection (16K byte/sector):

- Protect none, 1/4, 1/2 or all of array

• Built-In Write Protection:

- Power-on/off data protection circuitry

- Write enable latch

- Write-protect pin

• High Reliability:

- Endurance: 1 Million erase/write cycles

- Data Retention: >200 years

- ESD Protection: >4000V

• Temperature Ranges Supported:

- Industrial (I):

-40C to +85C

- Automotive (E):

-40°C to +125°C

• Pb-free and RoHS Compliant

Description:

The Microchip Technology Inc. 25LC512 is a 512 Kbit

serial EEPROM memory with byte-level and page-level

serial EEPROM functions. It also features Page, Sector

and Chip erase functions typically associated with

Flash-based products. These functions are not required

for byte or page write operations. The memory is

accessed via a simple Serial Peripheral Interface (SPI)

compatible serial bus. The bus signals required are a

clock input (SCK) plus separate data in (SI) and data out

(SO) lines. Access to the device is controlled by a Chip

Select (CS) input.

Communication to the device can be paused via the

hold pin (HOLD). While the device is paused, transi-

tions on its inputs will be ignored, with the exception of

Chip Select, allowing the host to service higher priority

interrupts.

The 25LC512 is available in standard packages includ-

ing 8-lead PDIP, SOIC, and advanced 8-lead DFN

package. All packages are Pb-free and RoHS

compliant.

Package Types (not to scale)

DFN

25LC512

CS 1

SO 2

WP 3

(MF)

HOLD

SCK

PDIP/SOIC/SOIJ

(P, SN, SM)

25LC512

HOLD

SCK

Pin Function Table

Name

SCK

HOLD

Function

Chip Select Input

Serial Data Output

Write-Protect

Ground

Serial Data Input

Serial Clock Input

Hold Input

Supply Voltage



2010 Microchip Technology Inc.

DS22065C-page 1

25LC512-I/MF相似产品对比

	25LC512-I/MF	25LC512-E/SM	25LC512T-E/SM	25LC512T-I/MF	25LC512T-I/P	25LC512T-I/SM	25LC512_10
描述	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDSO8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8
内存宽度	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8
组织	64KX8	64KX8	64KX8	64KX8	64K X 8	64KX8	64K X 8
温度等级	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	GULL WING	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
是否无铅	不含铅	不含铅	不含铅	不含铅	-	不含铅	-
是否Rohs认证	符合	符合	符合	符合	-	符合	-
零件包装代码	DFN	SOIC	SOIC	DFN	-	SOIC	-
包装说明	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	-	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	-
针数	8	8	8	8	-	8	-
Reach Compliance Code	compli	compli	compli	compli	-	compli	-
ECCN代码	EAR99	EAR99	EAR99	EAR99	-	EAR99	-
Factory Lead Time	13 weeks	29 weeks	29 weeks	14 weeks	-	29 weeks	-
最大时钟频率 (fCLK)	20 MHz	20 MHz	20 MHz	20 MHz	-	20 MHz	-
数据保留时间-最小值	200	200	200	200	-	200	-
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	-
JESD-30 代码	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-N8	-	R-PDSO-G8	-
JESD-609代码	e3	e3	e3	e3	-	e3	-
长度	6 mm	5.26 mm	5.26 mm	6 mm	-	5.26 mm	-
内存密度	524288 bi	524288 bi	524288 bi	524288 bi	-	524288 bi	-
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	-	EEPROM	-
湿度敏感等级	3	3	3	3	-	3	-
字数	65536 words	65536 words	65536 words	65536 words	-	65536 words	-
字数代码	64000	64000	64000	64000	-	64000	-
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-
最高工作温度	85 °C	125 °C	125 °C	85 °C	-	85 °C	-
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
封装代码	HVSON	SOP	SOP	HVSON	-	SOP	-
封装等效代码	SOLCC8,.25	SOP8,.3	SOP8,.3	SOLCC8,.25	-	SOP8,.3	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE	-
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL	-
峰值回流温度（摄氏度）	260	NOT SPECIFIED	NOT SPECIFIED	260	-	NOT SPECIFIED	-
电源	2.5/5 V	3/5 V	3/5 V	2.5/5 V	-	2.5/5 V	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
座面最大高度	1 mm	2.03 mm	2.03 mm	1 mm	-	2.03 mm	-
串行总线类型	SPI	SPI	SPI	SPI	-	SPI	-
最大待机电流	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	0.000001 A	-
最大压摆率	0.01 mA	0.01 mA	0.01 mA	0.01 mA	-	0.01 mA	-
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	-
最小供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V	-
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	-	5 V	-
表面贴装	YES	YES	YES	YES	-	YES	-
技术	CMOS	CMOS	CMOS	CMOS	-	CMOS	-
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	-
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	-
处于峰值回流温度下的最长时间	40	NOT SPECIFIED	NOT SPECIFIED	40	-	NOT SPECIFIED	-
宽度	5 mm	5.25 mm	5.25 mm	5 mm	-	5.25 mm	-
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	-	5 ms	-
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	-
Base Number Matches	1	1	1	1	-	1	-

25LC512-I/MF

25LC512-I/MF概述

25LC512-I/MF规格参数

用户手册

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25LC512-I/MF相似产品对比

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