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i.MX27L

产品描述Multimedia Applications Processor
文件大小2MB,共148页
制造商FREESCALE (NXP)
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i.MX27L概述

Multimedia Applications Processor

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i.MX27 and i.MX27L
i.MX27 and i.MX27L
Data Sheet
Multimedia Applications
Processor
1
Introduction
1.
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Case 1931-04
(MAPBGA-473)
Ordering Information
See
Table 1 on page 4
for ordering information.
The i.MX27 and i.MX27L (MCIMX27/MX27L)
Multimedia Applications Processors represents the next
step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX27 and
i.MX27L processors and referred to singularly
throughout this document as i.MX27.
The i.MX27L does not include the following features:
ATA-6 HDD Interface, Memory Stick Pro, VPU:
MPEG-4/ H.263/H.264 HW encoder/decoder, and
eMMA (PrP processing, CSC, deblock, dering).
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27/27L processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
2.
3.
5.
6.
7.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description and Application Information . . . . 4
2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4
2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35
3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 36
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . 40
4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40
4.2. Module-Level Electrical Specifications . . . . . . . . 43
4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54
Package Information and Pinout . . . . . . . . . . . . . . . . 105
5.1. Full Package Outline Drawing (17 mm
× 17
mm) 105
5.2. Pin Assignments (17 mm
×
17 mm) . . . . . . . . . 106
5.3. Full Package Outline Drawing (19 mm
× 19
mm) 125
5.4. Pin Assignments (19 mm
×
19 mm) . . . . . . . . . 126
Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 147
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2007, 2009. All rights reserved.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MCIMX27VOP4A, MCIMX27LVOP4A, MCIMX27MOP4A, MCIMX27LMOP4A
Freescale Semiconductor
Data Sheet, Technical Data
Document Number: MCIMX27EC
Rev. 1.5, 12/2009
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