• Supplied in tape and reel packaging, 1,500 parts per
13” diameter reel
Product Specifications
Part
Number
6
HCM0703-R15-R
HCM0703-R22-R
HCM0703-R47-R
HCM0703-R68-R
HCM0703-R82-R
HCM0703-1R0-R
HCM0703-1R5-R
HCM0703-2R2-R
HCM0703-3R3-R
HCM0703-4R7-R
HCM0703-6R8-R
HCM0703-8R2-R
HCM0703-100-R
OCL (μH)
±20%
0.15
0.22
0.47
0.68
0.82
1.00
1.50
2.20
3.30
4.70
6.80
8.20
10.0
1
FLL min,
(μH)
0.09
0.13
0.28
0.41
0.49
0.60
0.90
1.32
1.98
2.82
4.08
4.92
6.00
2
Irms
3
(Amps)
26.0
23.0
17.5
15.5
13.0
11.0
9.00
8.00
6.00
5.50
4.50
4.00
3.20
Isat
4
@ 20°C
(Amps)
52.0
40.0
26.0
25.0
24.0
22.0
18.0
14.0
13.5
10.0
8.00
7.50
7.00
DCR (mΩ) @ 20°C DCR (mΩ) @ 20°C
(Typical)
1.90
2.50
4.00
5.00
6.70
9.00
14.0
18.0
28.0
37.0
54.0
64.0
70.5
(Maximum)
2.50
2.80
4.20
5.50
8.00
10.0
15.0
20.0
30.0
40.0
60.0
68.0
77.6
K-factor
5
1610.3
615.4
430.2
367.4
286.2
259.7
175.7
163.6
158.2
118.1
106.8
95.3
81.2
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc, @ +20°C.
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ +20°C.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4 Isat: Peak current for approximately 20% rolloff at +20°C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI.
Bp-p (Gauss),
K: (K-factor from table), L: (inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
6 Part Number Definition: HCM0703-xxx-R
• HCM0703 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point,
If no R is present then 3
rd
digit equals number of zeros.
• “-R” suffix = RoHS compliant
1209
BU-SB091169
Page 1 of 4
Data Sheet: 4085
Dimensions - mm
T o p V ie w
7 .1 0
±0 .3 0
S id e V ie w
3 .0
m a x.
B o tto m V ie w
4 .0 typ .
S ch e m a tic
R e co m m e n d e d P a d L a yo u t
3 .3
w w llyy R
1
2 .3
1
6 .8 0
±0 .2 0
XXX
1
2
7 .4
2
1
2 .9 5
±0 .2 0
1 .6 0
±0 .3 0
2
7 .1
2
3 .0
P a rt m a rkin g : x x x = In d u c ta n c e v a lu e in u H , R = d e c im a l p o in t, If n o R is p re s e n t th e n la s t d ig it is # o f z e ro e s
w w llyy= D a te co d e ,
R = R e visio n le ve l
T o le ra n ce s a re ± 0 .3 u n le ss o th e r w ise sp e cifie d .
Packaging Information - mm
4.0
1.5 dia.
A
7.2
1.75
2.0
7.5
1
XXX
w w llyy R
2
16.0
±0.3
B
12.0
A
3.8
7.5
S E C TIO N A -A
B
3.1
S E C TIO N B -B
1.5 dia.
U ser direction of feed
7.2
Supplied in tape-and-reel packaging, 1,500 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
60
50
Temperature Rise (ºC)
40
30
20
10
0
0
0 .3
0 .6
0 .9
1 .2
1 .5
Total Loss (W)
1209
BU-SB091169
Page 2 of 4
Data Sheet: 4085
Core Loss
Core Loss vs. Bp-p
10
1MHz 500kHz 300kHz
200kHz
100kHz
1
Core loss (W)
0.1
0.01
0.001
100
1000
10000
Bp-p (Gauss)
Inductance Characteristics
100%
% of OCL vs % of I sat
80%
% of OCL
60%
40%
20%
0%
0%
20%
40%
60%
80%
1 00%
120%
140%
160%
180%
200%
% of Isat
1209
BU-SB091169
Page 3 of 4
Data Sheet: 4085
Solder Reflow Profile
T
P
T
C
-5°C
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Volume
Package
mm
3
Thickness
<350
<1.6mm
260°C
1.6 – 2.5mm 260°C
>2.5mm
250°C
Time
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020D
Profile Feature
Preheat
and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
Table 2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
Microchip MCU
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