MASK ROM, 128KX8, 100ns, CMOS
| 参数名称 | 属性值 |
| 厂商名称 | United Microelectronics Corporation |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| JESD-30 代码 | X-XUUC-N29 |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 29 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| UM23C1101H-100 | UM23C1101-100 | UM23C1101M-120 | UM23C1101H-120 | UM23C1101M-100 | |
|---|---|---|---|---|---|
| 描述 | MASK ROM, 128KX8, 100ns, CMOS | MASK ROM, 128KX8, 100ns, CMOS, PDIP32 | MASK ROM, 128KX8, 120ns, CMOS, PDSO32 | MASK ROM, 128KX8, 120ns, CMOS | MASK ROM, 128KX8, 100ns, CMOS, PDSO32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 100 ns | 120 ns | 120 ns | 100 ns |
| JESD-30 代码 | X-XUUC-N29 | R-PDIP-T32 | R-PDSO-G32 | X-XUUC-N29 | R-PDSO-G32 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 29 | 32 | 32 | 29 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | SMALL OUTLINE | UNCASED CHIP | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | GULL WING | NO LEAD | GULL WING |
| 端子位置 | UPPER | DUAL | DUAL | UPPER | DUAL |
| 厂商名称 | United Microelectronics Corporation | - | - | United Microelectronics Corporation | United Microelectronics Corporation |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved