Fixed-Point DSP 144-LQFP -40 to 100
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP-144 |
| 针数 | 144 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| Samacsys Description | DSP Fix PT 16-Bit 160MHz 160MIPS |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | YES |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 20 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PQFP-G144 |
| JESD-609代码 | e4 |
| 长度 | 20 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 1 |
| DMA 通道数量 | 6 |
| 外部中断装置数量 | 4 |
| 端子数量 | 144 |
| 计时器数量 | 1 |
| 片上数据RAM宽度 | 16 |
| 片上程序ROM宽度 | 16 |
| 最高工作温度 | 100 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.6,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 32768 |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 | 1.65 V |
| 最小供电电压 | 1.55 V |
| 标称供电电压 | 1.6 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320VC5409APGE16 | TMS320VC5409AGGU16 | TMS320VC5409AGGU12 | TMS320VC5409AZGU16 | TMS320VC5409APGE12 | |
|---|---|---|---|---|---|
| 描述 | Fixed-Point DSP 144-LQFP -40 to 100 | Fixed-Point DSP 144-BGA MICROSTAR -40 to 100 | Fixed-Point DSP 144-BGA MICROSTAR -40 to 100 | Fixed-Point DSP 144-BGA MICROSTAR -40 to 100 | Fixed-Point DSP 144-LQFP -40 to 100 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | BGA | BGA | BGA | QFP |
| 包装说明 | LQFP-144 | LFBGA, BGA144,13X13,32 | LFBGA, BGA144,13X13,32 | LFBGA, BGA144(UNSPEC) | LQFP-144 |
| 针数 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | _compli | _compli | compli | compliant |
| Factory Lead Time | 1 week | 1 week | 1 week | 6 weeks | 1 week |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | YES | YES | YES | YES | YES |
| 位大小 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PQFP-G144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PQFP-G144 |
| JESD-609代码 | e4 | e0 | e0 | e1 | e4 |
| 长度 | 20 mm | 12 mm | 12 mm | 12 mm | 20 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 1 | 3 | 3 | 3 | 1 |
| DMA 通道数量 | 6 | 6 | 6 | 6 | 6 |
| 外部中断装置数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 144 | 144 | 144 | 144 | 144 |
| 计时器数量 | 1 | 1 | 1 | 1 | 1 |
| 片上数据RAM宽度 | 16 | 16 | 16 | 16 | 16 |
| 片上程序ROM宽度 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFBGA | LFBGA | LFBGA | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 | BGA144,13X13,32 | BGA144,13X13,32 | BGA144(UNSPEC) | QFP144,.87SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 220 | 220 | 260 | 260 |
| 电源 | 1.6,3.3 V | 1.6,3.3 V | 1.5,3.3 V | 1.6,3.3 V | 1.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 32768 | 32768 | 32768 | 32768 | 32768 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 1.6 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.6 mm |
| 最大供电电压 | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 最小供电电压 | 1.55 V | 1.55 V | 1.42 V | 1.55 V | 1.42 V |
| 标称供电电压 | 1.6 V | 1.6 V | 1.5 V | 1.6 V | 1.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | BALL | BALL | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | BOTTOM | BOTTOM | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 20 mm | 12 mm | 12 mm | 12 mm | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 |
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