电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/81004302G13LF

产品描述RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 2 %, 100 ppm, 43000 ohm, SURFACE MOUNT, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
下载文档 详细参数 全文预览

CHP1/81004302G13LF概述

RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 2 %, 100 ppm, 43000 ohm, SURFACE MOUNT, 1206, ROHS COMPLIANT

CHP1/81004302G13LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TT Electronics plc
包装说明, 1206
Reach Compliance Codecompliant
JESD-609代码e1
制造商序列号CHP
安装特点SURFACE MOUNT
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法TR, 13 INCH
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻43000 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
端子面层TIN SILVER COPPER
端子形状WRAPAROUND
容差2%
工作电压200 V

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
st F7 +老人紧急呼救+试试超级玛丽
本帖最后由 247153481 于 2015-10-7 13:10 编辑 拿到板子,大屏幕,太喜欢了。 不如先玩一玩超级玛丽? 216414 216415 216416 216417 216418 本来需要8个按键的,但是板子只有一个 ......
247153481 stm32/stm8
嵌入式C语言里的土豪们之除法与移位
简单给大家分析一下嵌入式C语言编程时用到的除法与移位。   除法土豪   除法在嵌入式微处理器里可算是一个消耗大户,复杂的实现方式不仅占用了大师宝贵的计算时间而且精度有限情 ......
Jacktang 微控制器 MCU
[LPC54102] + 大体的硬件搭好
:loveliness::loveliness:第一次用洞洞板搭电路,这次把OLED和加速度加在一个洞洞板上,大体的硬件就差不多搭好,现在这要做软件方面的了,上我高大上的洞洞板电路{:1_102:}{:1_102:}{:1_102:} ......
强仔00001 NXP MCU
SensorTile的boot过程
本帖最后由 fyaocn 于 2017-3-10 16:57 编辑 1、在提供的范例包中,motenv1中已经有了hex文件,可以直接下载到内存。这个过程,体现了L476的启动和内存分配过程。2、首先执行,CleanMotEnv1. ......
fyaocn MEMS传感器
STM32定时器与PWM快速使用入门
STM32定时器与PWM快速使用入门要求:在万利的开发板EK-STM32F上产生周期为1秒,占空比分别为50%10%的PWM并且点亮板上的LD1,LD2灯闪烁。做法很简单。STM32的PWM是由定时器来产生的。可以 ......
yewuyi stm32/stm8
STM32F429I-discovery+FreeRTOS+STemWin
STM32F429I-discovery+FreeRTOS+STemWin,小试了一下,刷屏速度还是很快的,比LPC1788快。本来是打算回来后周末移植的RTOS+emwin的,后来发现Demo里面都有现成的了,但是发现一下问题,就是有些 ......
ou513 stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1507  451  1199  2382  915  31  10  25  48  19 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved