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Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MSP430F6630IZQWT

MSP430F6630IZQWT: 产品描述MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小4MB，共132页; 制造商Texas Instruments(德州仪器); 官网地址http://www.ti.com.cn/; 标准

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MSP430F6630IZQWT概述

MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85

MSP430F6630IZQWT规格参数

参数名称	属性值
Brand Name	Texas Instruments
是否无铅	含铅
是否Rohs认证	符合
厂商名称	Texas Instruments(德州仪器)
零件包装代码	BGA
包装说明	VFBGA,
针数	113
Reach Compliance Code	compliant
具有ADC	NO
其他特性	ALSO OPERATES 1.8V AT 8 MHZ
地址总线宽度
位大小	16
最大时钟频率	32 MHz
DAC 通道	NO
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PBGA-B113
JESD-609代码	e1
长度	7 mm
湿度敏感等级	3
I/O 线路数量	74
端子数量	113
最高工作温度	85 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装形状	SQUARE
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
ROM可编程性	FLASH
座面最大高度	1 mm
速度	20 MHz
最大供电电压	3.6 V
最小供电电压	2.4 V
标称供电电压	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.5 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	7 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

MSP430F6630IZQWT相似产品对比

	MSP430F6630IZQWT	MSP430F6633IZQW	MSP430F6631IZQW	MSP430F6631IZQWT	MSP430F6630IZQW	MSP430F6632IZQW	MSP430F6632IZQWT	MSP430F6634IZQW
描述	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR -40 to 85	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113	MSP430F663x Mixed Signal Microcontroller 113-BGA MICROSTAR JUNIOR	16-BIT, FLASH, 20MHz, RISC MICROCONTROLLER, PBGA113, PLASTIC, BGA-113
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	VFBGA,	PLASTIC, BGA-113	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
针数	113	113	113	113	113	113	113	113
Reach Compliance Code	compliant	unknown	unknown	compliant	unknown	unknown	compliant	unknown
具有ADC	NO	YES	NO	NO	NO	NO	NO	YES
其他特性	ALSO OPERATES 1.8V AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
位大小	16	16	16	16	16	16	16	16
最大时钟频率	32 MHz	20 MHz	20 MHz	32 MHz	20 MHz	20 MHz	32 MHz	20 MHz
DAC 通道	NO	NO	NO	NO	NO	NO	NO	NO
DMA 通道	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113	S-PBGA-B113
长度	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
I/O 线路数量	74	74	74	74	74	74	74	74
端子数量	113	113	113	113	113	113	113	113
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
座面最大高度	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
速度	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
标称供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
认证状态	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified

MSP430F6630IZQWT

MSP430F6630IZQWT概述

MSP430F6630IZQWT规格参数

MSP430F6630IZQWT相似产品对比

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