NLU1GT126
Non-Inverting 3-State
Buffer, TTL Level
LSTTL-Compatible Inputs
The NLU1GT126 MiniGatet is an advanced CMOS high-speed
non-inverting buffer in ultra-small footprint.
The NLU1GT126 requires the 3-state control input (OE) to be set
Low to place the output in the high impedance state.
The device input is compatible with TTL-type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT126 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
Features
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MARKING
DIAGRAMS
UDFN6
MU SUFFIX
CASE 517AA
1
ULLGA6
1.0 x 1.0
CASE 613AD
9M
•
•
•
•
•
•
•
•
9M
High Speed: t
PD
= 3.8 ns (Typ) @ V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 2
mA
(Max) at T
A
= 25°C
TTL-Compatible Input: V
IL
= 0.8 V; V
IH
= 2.0 V
CMOS-Compatible Output:
V
OH
> 0.8 V
CC
; V
OL
< 0.1 V
CC
@ Load
Power Down Protection Provided on inputs
Balanced Propagation Delays
Ultra-Small Packages
These are Pb-Free Devices
1
1
ULLGA6
1.2 x 1.0
CASE 613AE
9M
ULLGA6
1.45 x 1.0
CASE 613AF
1
9
M
= Device Marking
= Date Code
9M
OE
1
6
V
CC
PIN ASSIGNMENT
IN A
2
5
NC
1
2
3
GND
3
4
OUT Y
4
5
OE
IN A
GND
OUT Y
NC
V
CC
Figure 1. Pinout
(Top View)
6
FUNCTION TABLE
Input
OE
IN A
OUT Y
A
L
H
X
OE
H
H
L
Output
Y
L
H
Z
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2008
1
March, 2008 - Rev. 2
Publication Order Number:
NLU1GT126/D
NLU1GT126
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
MSL
F
R
I
LATCHUP
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
V
IN
< GND
V
OUT
< GND
Parameter
Value
-0.5 to +7.0
-0.5 to +7.0
-0.5 to +7.0
-20
±20
±12.5
±25
±25
-65 to +150
260
150
Level 1
UL 94 V-0 @ 0.125 in
±500
mA
Unit
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
Latchup Performance Above V
CC
and Below GND at 125°C (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
Dt/DV
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
Operating Free-Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Parameter
Min
1.65
0
0
-55
0
0
Max
5.5
5.5
5.5
+125
100
20
Unit
V
V
V
°C
ns/V
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2
NLU1GT126
DC ELECTRICAL CHARACTERISTICS
T
A
= 25
5C
Symbol
V
IH
V
IL
V
OH
Parameter
Low-Level Input
Voltage
Low-Level Input
Voltage
High-Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OH
= -50
mA
V
IN
= V
IH
or V
IL
I
OH
= -4 mA
I
OH
= -8 mA
V
OL
Low-Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OL
= 50
mA
V
IN
= V
IH
or V
IL
I
OL
= 4 mA
I
OL
= 8 mA
I
IN
I
CC
I
CCT
Input Leakage
Current
Quiescent Supply
Current
Quiescent Supply
Current
Output Leakage
Current
3-State Leakage
Current
0
v
V
IN
v
5.5 V
0
v
V
IN
v
V
CC
V
IN
= 3.4 V
Other Input: V
CC
or GND
V
OUT
= 5.5 V
V
IN
= V
IH
or V
IL
V
OUT
= V
CC
or
GND
Conditions
V
CC
(V)
3.0
4.5 to 5.5
3.0
4.5 to 5.5
3.0
4.5
3.0
4.5
3.0
4.5
3.0
4.5
0 to 5.5
5.5
5.5
2.9
4.4
2.58
3.94
0
0
0.1
0.1
0.36
0.36
±0.1
1.0
1.35
3.0
4.5
Min
1.4
2.0
0.53
0.8
2.9
4.4
2.48
3.80
0.1
0.1
0.44
0.44
±1.0
20
1.50
Typ
Max
T
A
=
+855C
Min
1.4
2.0
0.53
0.8
2.9
4.4
2.34
3.66
0.1
0.1
0.52
0.52
±1.0
40
1.65
mA
mA
mA
V
Max
T
A
= -555C
to +1255C
Min
1.4
2.0
0.53
0.8
Max
Unit
V
V
V
I
OPD
I
OZ
0
0
0.5
±0.25
5.0
±2.5
10
±2.5
mA
mA
AC ELECTRICAL CHARACTERISTICS
(Input t
r
= t
f
= 3.0 ns)
T
A
= 25
5C
Min
Typ
5.6
8.1
3.8
5.3
5.4
7.9
3.6
5.1
6.5
8.0
4.8
7.0
4
6
Max
8.0
11.5
5.5
7.5
8.0
11.5
5.1
7.1
9.7
13.2
6.8
8.8
10
T
A
=
+855C
Min
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Max
9.5
13
6.5
8.5
9.5
13
6.0
8.0
11.5
15
8.0
10
10
T
A
= -555C
to +1255C
Min
Max
12
16
8.5
10.5
11.5
15
7.5
9.5
14.5
18.5
10
12
10
pF
pF
ns
ns
Unit
ns
Symbol
t
PLH
,
t
PHL
Parameter
Propagation Delay, A to
Y
(Figures 3 and 5)
V
CC
(V)
3.0 to 3.6
4.5 to 5.5
Test
Condition
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
t
PZL
,
t
PZH
Output Enable Time, OE to Y
(Figures 4 and 6)
3.0 to 3.6
4.5 to 5.5
t
PLZ
,
t
PHZ
Output Disable Time, OE to Y
(Figures 4 and 6)
3.0 to 3.6
4.5 to 5.5
C
IN
C
OUT
Input Capacitance
3-State Output Capacitance
(Output in High Impedance
State)
Power Dissipation
Capacitance (Note 3)
5.0
C
PD
14
pF
3. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
. C
PD
is used to determine the no-load
dynamic power consumption: P
D
= C
PD
•
V
CC2
•
f
in
+ I
CC
•
V
CC.
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3
NLU1GT126
SWITCHING WAVEFORMS
OE
V
CC
50%
A
t
PLH
50% V
CC
Y
Y
50% V
CC
t
PHL
GND
Y
t
PZL
t
PLZ
V
CC
50%
GND
HIGH
IMPEDANCE
V
OL
+ 0.3V
V
OH
- 0.3V
50% V
CC
t
PZH
t
PHZ
Figure 3. Switching Waveforms
Figure 4.
HIGH
IMPEDANCE
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kW
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL.
CONNECT TO GND
WHEN
TESTING t
PHZ
AND t
PZH.
C
L
*
DEVICE
UNDER
TEST
C
L
*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 5. Test Circuit
Figure 6. Test Circuit
INPUT
Figure 7. Input Equivalent Circuit
ORDERING INFORMATION
Device
NLU1GT126MUTCG
NLU1GT126AMX1TCG
NLU1GT126BMX1TCG
NLU1GT126CMX1TCG
Package
UDFN6
(Pb-Free)
ULLGA6, 1.45 x 1.0, 0.5P
(Pb-Free)
ULLGA6, 1.2 x 1.0, 0.4P
(Pb-Free)
ULLGA6, 1.0 x 1.0, 0.35P
(Pb-Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GT126
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE C
EDGE OF PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
D
A
B
L1
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
(A3)
A
A1
10X
0.08 C
SIDE VIEW
A1
5X
1
3
SEATING
PLANE
C
L
L2
6X
b
0.10 C A B
0.05 C
NOTE 3
6
4
e
BOTTOM VIEW
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5
ÉÉÉ
ÉÉÉ
ÉÉÉ
DETAIL B
Side View
(Optional)
0.40
PITCH
ÉÉ
ÉÉ
ÉÉ
E
DETAIL A
Bottom View
(Optional)
EXPOSED Cu
MOLD CMPD
TOP VIEW
A3
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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