电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDSM4-152SL4F8-0.5

产品描述152 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE
产品类别连接器    连接器   
文件大小303KB,共4页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
下载文档 详细参数 全文预览

HDSM4-152SL4F8-0.5概述

152 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE

HDSM4-152SL4F8-0.5规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
Reach Compliance Codeunknown
其他特性STANDRD: MIL-DTL-55302, POLARIZED
主体/外壳类型RECEPTACLE
连接器类型TELECOM AND DATACOM CONNECTOR
联系完成配合GOLD (50) OVER COPPER
联系完成终止GOLD (50) OVER COPPER
触点性别FEMALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料LIQUID CRYSTAL POLYMER
JESD-609代码e4
MIL 符合性YES
制造商序列号HDSM
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD AND PANEL
选件GENERAL PURPOSE
外壳面层NICKEL
外壳材料ALUMINUM ALLOY
端接类型SOLDER
触点总数152

文档预览

下载PDF文档
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
I
I
I
Rectangular
Connectors
I
I
I
I
I
I
2
I
I
Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
求WINCE下做视频播放方案
在WINCE下做视频播放,要求能播放播放AVI等文件(视频支持MEPG1\2\4、Divx、xVid格式,音频支持MP3、WAV、WAV)。对视频播放方面不太了解,请高人赐教方案及技术,有源码更好!~...
BITCH 嵌入式系统
求助......一个IC的擦除问题
MC68HC711KS2 请问哪位老大知道这颗IC写完程序后如何擦除.. 编程器上只有一个erse EEprom,这个不能擦掉全部的...
lixiyuan999 嵌入式系统
推荐一个可帮助调试BLE的App
本帖最后由 cruelfox 于 2017-7-18 16:14 编辑 NXP官方的 Kinetis BLE Toolbox 配合开发板的demo工程固然是好的,但自己要改了 BLE Profile 就用处不大了。 推荐一个App (android),是ST官 ......
cruelfox NXP MCU
半桥驱动器
半桥驱动器(也称为高侧/低侧驱动器)可降低开关损耗、适应噪声环境并提高系统效率。 MOSFET 和 IGBT 栅极驱动器电路的基本原理 减少内部自举二极管中的损耗 50161250161350161450161550 ......
Jacktang 模拟与混合信号
ARM教程从基础到应用 pdf
今天为大家推荐的资源是—— ARM教程从基础到应用 ,这是四个PDF文件,分为 初级/ 中级/高级/系统 四篇,包括系统架构到实战操作,是非常详尽的ARM教程,图文并茂,值得一看! 话不多说,下 ......
linjiang 下载中心专版
班库急招赴日嵌入式软件工程师和控制应用程序开发工程师
班库急招赴日嵌入式软件工程师和控制应用程序开发工程师 班库猎头!www.intebankhr.com现在急招赴日嵌入式软件工程师和控制应用程序开发工程师 具体职位如下: 1 嵌入式软件工程师 SEレベル ......
intebank 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1031  2554  392  2108  1084  39  31  6  50  24 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved