IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
包装说明 | DIP, DIP20,.3 |
Reach Compliance Code | not_compliant |
JESD-30 代码 | R-XDIP-T20 |
JESD-609代码 | e0 |
内存密度 | 8192 bit |
内存集成电路类型 | OTP ROM |
内存宽度 | 4 |
端子数量 | 20 |
字数 | 2048 words |
字数代码 | 2000 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 2KX4 |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
HM1-7686R-2 | HM1-7686R-5 | HM1-7686R-7 | HM1-7686RP-2 | HM1-7686RP-5 | HM1-7686RP-7 | |
---|---|---|---|---|---|---|
描述 | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC | IC,PROM,2KX4,TTL,DIP,20PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
包装说明 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
组织 | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
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