IC,PRESCALER,DIP,24PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-XDIP-T24 |
| 负载/预设输入 | YES |
| 逻辑集成电路类型 | PRESCALER |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 最大电源电流(ICC) | 50 mA |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-208-9456 | 5962-01-229-1655 | CD4059AE | CD4059AD3 | CD4059AK3 | CD4059AK | CD4059AF3 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,PRESCALER,DIP,24PIN,CERAMIC | IC,PRESCALER,DIP,24PIN,CERAMIC | DIVIDE BYN COUNTER | 4000/14000/40000 SERIES, ASYN POSITIVE EDGE TRIGGERED DOWN DIVIDE BY N COUNTER, CDIP24, CERAMIC, DIP-24 | CD4059AK3 | CD4059AK | IC,PRESCALER,DIP,24PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-CDIP-T24 | R-XDFP-F24 | R-XDFP-F24 | R-XDIP-T24 |
| 逻辑集成电路类型 | PRESCALER | PRESCALER | DIVIDE BY N COUNTER | DIVIDE BY N COUNTER | PRESCALER | PRESCALER | PRESCALER |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DFP | DFP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | FL24,.4 | FL24,.4 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 最大电源电流(ICC) | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | - | - | DIP, DIP24,.6 |
| 负载/预设输入 | YES | YES | YES | YES | - | - | YES |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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