3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, |
针数 | 54 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-PDSO-G54 |
长度 | 22.22 mm |
内存密度 | 67108864 bi |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 54 |
字数 | 4194304 words |
字数代码 | 4000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
AS4LC4M16S0-75TC | AS4LC4M16S0 | AS4LC4M16S0-10FTC | AS4LC4M16S0-10TC | AS4LC4M16S0-8TC | AS4LC8M8S0 | AS4LC8M8S0-10TC | AS4LC8M8S0-10FTC | AS4LC8M8S0-8TC | AS4LC8M8S0-75TC | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM | 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
包装说明 | TSOP2, | - | TSOP2, | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | - | TSOP2, TSOP54,.46,32 | TSOP2, | TSOP2, TSOP54,.46,32 | TSOP2, |
针数 | 54 | - | 54 | 54 | 54 | - | 54 | 54 | 54 | 54 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | - | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns | - | 6 ns | 6 ns | 6 ns | - | 6 ns | 6 ns | 6 ns | 5.4 ns |
其他特性 | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-PDSO-G54 | - | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | - | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 |
长度 | 22.22 mm | - | 22.22 mm | 22.22 mm | 22.22 mm | - | 22.22 mm | 22.22 mm | 22.22 mm | 22.22 mm |
内存密度 | 67108864 bi | - | 67108864 bi | 67108864 bi | 67108864 bi | - | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi |
内存集成电路类型 | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 16 | - | 16 | 16 | 16 | - | 8 | 8 | 8 | 8 |
功能数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端口数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 54 | - | 54 | 54 | 54 | - | 54 | 54 | 54 | 54 |
字数 | 4194304 words | - | 4194304 words | 4194304 words | 4194304 words | - | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 4000000 | - | 4000000 | 4000000 | 4000000 | - | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4MX16 | - | 4MX16 | 4MX16 | 4MX16 | - | 8MX8 | 8MX8 | 8MX8 | 8MX8 |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | YES | - | YES | YES | YES | - | YES | YES | YES | YES |
最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | - | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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