PLL FREQUENCY SYNTHESIZER, 6MHz, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, LDCC28,.5SQ |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 其他特性 | ADDITIONAL 6-BIT AUXILIARY INPUT COUNTER |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 长度 | 11.5062 mm |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/9 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电流 (Isup) | 30 mA |
| 最大供电电压 (Vsup) | 9 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.5062 mm |
| MC145152FN2 | MC145157FN2R2 | 0761551108_17 | MC145151FN2R2 | MC145156FN2R2 | |
|---|---|---|---|---|---|
| 描述 | PLL FREQUENCY SYNTHESIZER, 6MHz, PQCC28, PLASTIC, LCC-28 | PLL FREQUENCY SYNTHESIZER, 6MHz, PQCC20, PLASTIC, LCC-20 | Impact 100 Ohm 4 Pair Vertical Backplane Header, Unguided, Open Endwall | PLL Frequency Synthesizer, CMOS, PQCC28, PLASTIC, LCC-28 | PLL Frequency Synthesizer, CMOS, PQCC20, PLASTIC, LCC-20 |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | - | - | Motorola ( NXP ) |
| 包装说明 | QCCJ, LDCC28,.5SQ | QCCJ, | - | QCCJ, | QCCJ, |
| Reach Compliance Code | unknown | unknown | - | unknown | unknown |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | - | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | S-PQCC-J28 | S-PQCC-J20 | - | S-PQCC-J28 | S-PQCC-J20 |
| 长度 | 11.5062 mm | 8.9662 mm | - | 11.5062 mm | 8.9662 mm |
| 功能数量 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 28 | 20 | - | 28 | 20 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | - | QCCJ | QCCJ |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | - | 4.57 mm | 4.57 mm |
| 最大供电电流 (Isup) | 30 mA | 30 mA | - | 30 mA | 30 mA |
| 最大供电电压 (Vsup) | 9 V | 9 V | - | 9 V | 9 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | J BEND | J BEND | - | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | - | QUAD | QUAD |
| 宽度 | 11.5062 mm | 8.9662 mm | - | 11.5062 mm | 8.9662 mm |
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