INTERCONNECTS
SERIES 310, 330, 351• .100” GRID (.018” DIA. PINS),
SURFACE MOUNT HEADERS AND SOCKETS • SINGLE ROW STRIPS
Mates with Series 310...023 Surface Mount
Z-Bend Socket (See Fig. 3)
.062 DIA.
HOLE
.100 DIA.
.018 DIA.
•
Series 351 horizontal surface mount headers
are availble with .018” dia. pluggable pins
(MM #5102). Series 330 horizontal surface
mount z-bend headers use MM #3027 pins.
See page 224 for details
Number of Pins x .100"
•
Series 310 horizontal surface mount Z-Bend
.100
A
.050
.005 A
.110
.080
.100
.070
(TYP)
sockets uses MM #1023 receptacles that accept
pin diameters from .015”-.025”. See pages 171
for details
suitable for all soldering operations
.120
.397
•
Insulators are high temperature thermoplastic,
•
Ideal for daisy chaining parallel boards
Coplanarity .005”. For pin counts >10 positions,
consult Technical Support.
FIG. 1
Mates with Series 310...023 Surface Mount
Z-Bend Socket (See Fig. 3)
.018 DIA.
.052 DIA.
ORDERING INFORMATION
Series 351...002
.018” Dia. Surface Mount Header
351-10-1_ _-40-002000
Specify number of pins
02-10
FIG. 1
Series 330...027
.022 DIA.
Number of Pins x .100"
.018” Dia. Surface Mount Z-Bend Header
330-XX-1_ _-40-027000
02-10
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.050
.005 A
A
.100
FIG. 2
RoHS - 2
.045
.110
.125
.155
(.401)
.166
(TYP)
.100
Specify number of pins
XX=Plating Code
See Below
10
10
μ”
Au
2011/65/EU
Coplanarity .005”. For pin counts >10 positions,
consult Technical Support.
SPECIFY PLATING CODE XX=
Pin Plating
40
200
μ”
Sn
FIG. 2
Mates with Series 351...002 and 330...027
Surface Mount Header (See Fig. 1 & 2)
.110
.088
.022 DIA.
Series 310...023
.018” Dia. Surface Mount Z-Bend Socket
310-XX-1_ _-40-023000
02-10
FIG. 3
Specify number of pins
Number of Pins x .100"
PAGE 50 | INTERCONNECTS
.050
.005 A
A
.100
.040
(TYP)
.100
.165
.279
.114
2011/65/EU
RoHS - 2
XX=Plating Code
See Below
91
10
μ”
Au
For
Electrical, Mechanical
& Enviromental Data,
See page 264
Coplanarity .005”. For pin counts >10 positions,
consult Technical Support.
SPECIFY PLATING CODE XX=
Sleeve
(Pin)
Contact
(Clip)
93
99
41
43
200
μ”
Sn
30
μ”
Au
44
200
μ”
Sn
100
μ”
Sn
FIG. 3
200
μ”
Sn/Pb 200
μ”
Sn/Pb 200
μ”
Sn/Pb
200
μ”
Sn
30
μ”
Au
100
μ”
Sn/Pb
10
μ”
Au
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
