150-mW Stereo Audio Power Amplifier 8-SOIC
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 增益 | 20 dB |
| 谐波失真 | 0.1% |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.07 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大压摆率 | 3 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| TPA112D | TPA112DGN | TPA112DGNR | TPA112DR | |
|---|---|---|---|---|
| 描述 | 150-mW Stereo Audio Power Amplifier 8-SOIC | Audio Amplifiers 150mW Stereo | Audio Amplifiers 150mW Stereo | 150-mW Stereo Audio Power Amplifier 8-SOIC |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | MSOP | MSOP | SOIC |
| 包装说明 | SOP, SOP8,.25 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week |
| 标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 谐波失真 | 0.1% | 0.1% | 0.1% | 0.1% |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 4.9 mm | 3 mm | 3 mm | 4.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 信道数量 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 0.07 W | 0.07 W | 0.07 W | 0.07 W |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | HTSSOP | HTSSOP | SOP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.19 | TSSOP8,.19 | SOP8,.25 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm |
| 最大压摆率 | 3 mA | 3 mA | 3 mA | 3 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
| 是否无铅 | 不含铅 | 含铅 | - | 不含铅 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
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