16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28, CERAMIC, FLATPACK-28
16通道, SGL 终端多路复用器, CDFP28
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| Objectid | 1021245732 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-CDFP-F28 |
| JESD-609代码 | e4 |
| 负电源电压最大值（Vsup） | -16 V |
| 负电源电压最小值（Vsup） | -15 V |
| 标称负供电电压 (Vsup) | -15.5 V |
| 信道数量 | 16 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 (Vsup) | 16 V |
| 最小供电电压 (Vsup) | 15 V |
| 标称供电电压 (Vsup) | 15.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 12.445 mm |
| HS9-1840BRH/PROTO | 5962F9563003VXC | HS1-1840ARH/PROTO | HS1-1840BRH/PROTO | HS9-1840ARH/PROTO | |
|---|---|---|---|---|---|
| 描述 | 16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28, CERAMIC, FLATPACK-28 | 16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28 | 16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28 | 16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28 | 16-CHANNEL, SGL ENDED MULTIPLEXER, CDFP28 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 表面贴装 | YES | Yes | Yes | Yes | Yes |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大工作温度 | - | 125 Cel | 125 Cel | 125 Cel | 125 Cel |
| 最小工作温度 | - | -55 Cel | -55 Cel | -55 Cel | -55 Cel |
| 最大供电/工作电压 | - | 16 V | 16 V | 16 V | 16 V |
| 最小供电/工作电压 | - | 15 V | 15 V | 15 V | 15 V |
| 额定供电电压 | - | 15.5 V | 15.5 V | 15.5 V | 15.5 V |
| 加工封装描述 | - | CERAMIC, FLATPACK-28 | CERAMIC, FLATPACK-28 | CERAMIC, FLATPACK-28 | CERAMIC, FLATPACK-28 |
| 状态 | - | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| 工艺 | - | CMOS | CMOS | CMOS | CMOS |
| 包装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | - | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 端子间距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子涂层 | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 包装材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 输入数 | - | 16 | 16 | 16 | 16 |
| 最大接通时间 | - | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 最大关断时间 | - | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 模拟IC其它类型 | - | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER |
| 关闭状态下的隔离额定值 | - | 45 dB | 45 dB | 45 dB | 45 dB |
| 最大限制模拟输入电压 | - | 35 V | 35 V | 35 V | 35 V |
| 额定负供电电压 | - | -15.5 V | -15.5 V | -15.5 V | -15.5 V |
| 最大通态电阻 | - | 4000 ohm | 4000 ohm | 4000 ohm | 4000 ohm |
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