MN101CA3 Series
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN101CA3F
Mask ROM
96K
4K
MN101CFA3G
FLASH
128K
10K
QFP100-P-1818B
0.1
µs (at
4.5
V to
5.5
V,
20
MHz)
0.24
µs (at
2.7
V to
5.5
V,
8.4
MHz)
0.48
µs (at
2.3
V to
5.5
V,
4.19
MHz)*
1.0
µs (at
2.0
V to
5.5
V,
2.0
MHz)*
62.5
µs (at
2.0
V to
5.5
V,
32
kHz)*
*: The lower limit for operation guarantee for flash memory built-in type is
2.5
V.
Interrupts
RESET. Watchdog. External
0
to
6.
Timer
0
to
4.
Timer
6.
Timer
7
(2 systems). Timer
8
(2 systems). Time base. Serial
0
(2 systems).
Serial
1
(2 systems). Serial
2.
Serial
3
(2 systems). A/D conversion finish. Automatic transfer finish. FL display key scan. FL display
dimmer
Timer Counter
8-bit
timer
×
6
Timer
0
..................Square-wave/8-bit PWM output. Event count. Remote control carrier output. Simple pulse width measurement
Timer
1
..................Square-wave output. Event count. Serial transfer clock output
Timer
2, 4
..............Square-wave/8-bit PWM output. Serial transfer clock output. Event count. Simple pulse width measurement
Timer
3
..................Square-wave output. Event count. Remote control carrier output. Serial transfer clock output
Timer
6
..................8-bit freerun timer
Timer
0, 1
can be cascade-connected
Timer
2, 3
can be cascade-connected
16-bit
timer
×
2
Timer
7, 8
..............Square-wave output.
16-bit
PWM output (cycle/duty continuous variable). Event count. Pulse width measurement.
Input capture
Time base timer: One-minute count setting
Watchdog timer
×
1
Serial interface
Synchronous type/UART (full-duplex)
×
2:
Serial
0, 1
Synchronous type/Single-master I
2
C
×
1:
Serial
2
UART (full-duplex)
×
1:
Serial
3
DMA controller
Maximum transfer cycles:
255
Starting factor: External request. Various types of interrupt. Software
Transfer mode:
1-byte
transfer. Word transfer. Burst transfer
I/O Pins
I/O
High Voltage
36
:
Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
53
:
Output:
26.
I/O:
27.
P-ch. open drain (breakdown voltage –40 V): FL drive:
53.
Specified pull-down resistor mask
option:
35
A/D converter
8-bit
×
8
channels (with S/H)
Display control function
FL: (35 to
43)
segments
×
(18 to
10)
digits
16
levels dimmer function
Light-and-dark
2-tones
display function
Can support automatic display to universal grid display tubes
Output dimmer waveform for FL driver connection (DROUT)
Internal pull down resister is available between Port
6
and Vpp, Port
9
and Vpp, Port B and Vpp, Port C and Vpp, Port D and Vpp by
Mask option (only for Mask ROM version)
Internal pull down resister between Port
4
and Vpp, Port
7
and Vpp, Port
8
and Vpp
MAD00068DEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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